search.noResults

search.searching

saml.title
dataCollection.invalidEmail
note.createNoteMessage

search.noResults

search.searching

orderForm.title

orderForm.productCode
orderForm.description
orderForm.quantity
orderForm.itemPrice
orderForm.price
orderForm.totalPrice
orderForm.deliveryDetails.billingAddress
orderForm.deliveryDetails.deliveryAddress
orderForm.noItems
DS-SEP24-PG57_Layout 1 13/09/2024 16:43 Page 1


FASTENINGS & ADHESIVES PRODUCTS


NEW MICROELECTRONICS ADHESIVE FOR ULTRA-FINE STRUCTURES LAUNCHED


A new adhesive - DUALBOND EG4797 - that can be used to create ultra-fine structures within seconds, has been developed by DELO, creating new possibilities in heterogeneous integration and optical packaging applications. Able to realise unlimited freeform structures and razor-thin optical barriers, the material also answers to the ongoing trend towards miniaturisation, the company explains. The halogen- and solvent-free acrylate allows for extremely fine microstructure designs –


so-called micro dams – in semiconductor packaging and on printed circuit boards. With it, bondlines with widths of less than 100µm in an aspect ratio of five or more can be dispensed. Previously, achieving line widths of even 200µm was considered a challenge. This new micro dam solution was developed in close partnership with NSW Automation, a systems manufacturer which produces high-precision microdispensing technologies for the semiconductor industry. The adhesive has a high thixotropic index of 6.6, enabling dispensing speeds of 15mm/s or


more, all while creating a stable microstructure layer by layer – on straight as well as curved surfaces. Fine bondlines are dispensed using conical needles with a diameter of 100µm. After dispensing, the micro dam is cured in one step. Curing can either be carried out in ten seconds using only UV light, in five minutes using only heat at +120˚C, or via a dual-curing process using both UV light and heat. DELO DUALBOND EG4797 proves to be a very good adhesive in testing typical for compliance to microelectronics and semiconductor industry standards, such as JEDEC MSL. This new product comes in response to increasing demand for high-performance electronic components and the ongoing trend towards miniaturisation, with more and more powerful functioning parts needing to be accommodated on PCBs.


DELO Adhesives www.delo-adhesives.com


DÜRR ADHESIVE PROCESS APPLICATIONS EXPAND FROM AUTOMOTIVE INTO NEW AREAS


HOMAG Plattenaufteiltechnik is incorporating adhesive processing products from its sister company Dürr to build vacuum tables for its SAWTEQ saws. Until now, Dürr’s adhesive dispensing technology has been exclusively utilised within the automotive sector, with the company having extensive experience in the areas of body-in-white, final assembly and battery assembly. As of this year, however, its glueing applications have been expanded to other industries. Particularly in general industry, the use of dosing technology for component joining presents challenges for various applications. Dürr addresses these challenges with a modular product system featuring standardised operating software, providing top-notch glueing technology, it explains. HOMAG’s horizontal panel dividing saws


deliver precise, cost-effective and adaptable panel cutting for customers in both craft and industry. The tabletops used to be manually screwed onto the sheet metal housing and further sealed with silicone, but the company decided to automate the process using Dürr products. The installation of the EcoRam drum press for material supply, the EcoShot Meter as a dosing unit, and the EcoGun2 PVA04 as an applicator, is currently underway. The entire system is regulated via the new EcoHVMP4 pump and metering


THERMALLY CONDUCTIVE STRUCTURAL EPOXY


Master Bond Supreme 11AOHTLP is a two


component epoxy featuring thermal conductivity and electrical insulation. This system is specifically designed for bonding larger parts as it has a relatively long working life of 60-90 minutes (at room temperature for a 100-gram batch). This makes it suitable for demanding situations where more time for fixturing is needed. The adhesive has reliable electrical insulation


properties with a volume resistivity exceeding 1014


ohm-cm at 75˚F. It also exhibits thermal


conductivity of 3-5 BTU·in/(ft²·hr·˚F) [0.5-0.7 W/m/K]. The system provides high bond strength properties with a lap shear strength of 3,200-3,400 psi, a tensile strength of 7,000-8,000 psi, a compressive strength of 20,000-22,000 psi and a T-peel strength of 15-20 pli. This toughened formulation is designed to withstand thermal cycling and offers a wide service temperature range from -80˚C to 204˚C. Supreme 11AOHTLP cures at room temperature in


two to three days, and in two to three hours at 200˚F. To optimise properties, the recommended cure schedule is overnight at room temperature, followed by a post cure at 120-150˚F for three to four hours. The adhesive bonds well to a wide variety of


substrates including metals, ceramics, glass, rubbers and many plastics. This epoxy system has a 1:1 mix ratio by weight, with the mixed material being a thixotropic paste. The company has developed a line of specialty


adhesives that meet stringent NASA low outgassing requirements (ASTM E595). Its low outgassing adhesives are designed for the electronic, optical, electro-optical and aerospace industries, where they prevent contamination and ensure optimal device functionality under demanding operating conditions.


Master Bond www.masterbond.com


The EcoGun WATER BASED ADHESIVES


control unit, with the automation solution scheduled for commissioning in early 2025. As part of the HOMAG project, Dürr is


introducing its new EcoHVC4 operating software for the first time. Until now, system control was strictly project-oriented, with software customised for each system on a project-specific basis. The HVMP4 standard shifts the focus to individual components, which can be combined via standardised interfaces. Customers have the flexibility to choose from a range of Dürr adhesive products tailored to their specific preferences and needs. The system allows for seamless integration of the components, with each product undergoing comprehensive testing to ensure a streamlined process flow.


Dürr www.durr.com/en


Chemique Adhesives has introduced a fire-retardant solution to its ProAqua range of water-based adhesives. ProAqua 3316 is a two-component water-based,


fire-retardant, sprayable adhesive that delivers exceptional performance. Its advanced formula boasts high initial tack for immediate hold and a soft, flexible glue line, ideal for intricate applications. Offering superior bonding capabilities, exceptional


flexibility, and unsurpassed safety compliance, ProAqua 3316 has been specifically developed for the foam and furniture industry and is suitable for applications including foam conversion, office seating, furniture manufacturing and upholstery tasks.


Chemique Adhesives and Sealants www.chemiqueadhesives.com


SEPTEMBER 2024 DESIGN SOLUTIONS 57


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54  |  Page 55  |  Page 56  |  Page 57  |  Page 58  |  Page 59  |  Page 60  |  Page 61  |  Page 62  |  Page 63  |  Page 64