Test & measurement
Feature sponsored by
Figure 5. Comparing the
loopback solution provided by relays vs. the ADGM1001.
offers minimal channel skew, jitter, and propagation delay enabling high fidelity data transmission. It provides a low insertion loss of 1.5dB at 34GHz and low RON of 3Ω typically. It offers excellent linearity of 69dBm and can handle high RF power of 33dBm. It comes in a small 5mm x 4mm x 0.95mm plastic SMD package, with 3.3V power supply and simple low voltage control interface. All these features make the ADGM1001 an ideal candidate for ATE applications enabling both high speed digital and DC parametric testing capability in a single test insertion, as shown in Figure 4. The ADGM1001 is easy to use. It can be
operated by applying VDD of 3.3V to Pin 23. However, VDD can operate from 3.0V to 3.6V.
BENEFITS OF THE ADGM1001 IN ENABLING A SINGLE INSERTION TEST
Superior high speed and DC performance: Achieving wide bandwidth from DC to 34GHz is the challenge for the industry today. ADGM1001 delivers leading performance from DC to 34GHz in the areas of critical parameters such as insertion loss, linearity, RF power handling, and RON.
Reduction in OPEX:
Hardware reduction: A single insertion test requires single test hardware; hence, users don’t need to invest in two sets of hardware and test equipment, enabling a huge reduction in OPEX.
Tester uptime: The ADGM1001 offers 100 million cycles providing superior reliability as compared to relays and improves tester uptime, which ultimately reduces OPEX.
Figure 7. ADGM1001 RF performance.
The switches can then be controlled normally via the logic control interface (Pin 1 to Pin 4) or via the SPI interface. All the required passive components for device functionality are integrated inside the package for ease of use and board space saving. Figure 8 shows the functional block diagram of the ADGM1001.
CONCLUSION The ADGM1001 is advancing switch technology from DC to 34GHz, enabling the combination of high speed digital and DC parametric solutions for SoC testing. Its capabilities enable test time reduction, improvements in board real estate (leading to higher DUT counts and throughput), and increased uptime (improved reliability). The ADGM1001 is the latest addition to the
Figure 8. ADGM1001 functional block diagram. 36
ADI’s MEMS switch family that continues to advance the needs of high speed SoC testing. ADI’s MEMS switch technology has a robust
Figure 6. Package type: 5mm x 4mm x 0.9mm, 24-lead LGA package.
Improved test throughput: The ADGM1001 enables the use of a single insertion test, reducing the indexing time to half, which improves the test time significantly and provides improved test throughput and better asset utilisation.
Dense solution and future-proof: The ADGM1001 offers improved densification and enhanced functionality. MEMS switch technology has robust roadmap serving switches that are operational from DC to high frequencies and it is fully aligned to evolving technologies.
Reduction in logistic costs: The single insertion method requires fewer component moves, which reduces logistic costs and eases off planning overload.
Fewer component moves: In the single insertion test method, the DUT is tested in single insertion only which reduces the component moves and ultimately reduces the risk of human error.
roadmap serving switching functions from DC to high frequencies to cater to future technology needs. So, stay tuned for future updates on ADI’s MEMS switch technology.
Analog Devices
www.analog.com
January 2023 Instrumentation Monthly
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