Instrumentation & Electronics Awards Supplement
THREE INNOVATIONS, THREE REASONS TO VOTE FOR SMITHS INTERCONNECT
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s AI, high-performance computing, broadband communications and mission-critical systems advance, the components supporting them must deliver more performance in less space - and often under extreme conditions. Smiths Interconnect, a Molex company, has earned three Product of the Year nominations for technologies that meet these challenges with performance, reliability and practical engineering.
TEST AND MEASUREMENT PRODUCT OF THE YEAR: L SERIES WITH NEW HIGH- POWER MODULES
As test and measurement environments evolve toward higher power density and increasingly complex system architectures, engineers are required to integrate multiple functions—power, signal, and high-speed data—within compact and reliable interfaces. At the same time, test systems must withstand frequent mating cycles, harsh environments, and demanding operational constraints without compromising performance or repeatability. The L Series High Density Modular Connectors are designed to address these challenges through a highly flexible and robust modular architecture. Their layout enables the combination of signal, power, coaxial, data, and pneumatic modules within a single connector frame, significantly simplifying system integration while reducing the need for multiple interconnect solutions. This modular building-block approach allows engineers to configure connectors tailored to specific applications using off-the-shelf components, reducing both complexity and lead times. With the addition of new high-power modules equipped with Hypertac Green Connect contact technology supporting currents up to 250 A, the L Series extends its capabilities to meet the needs of modern high-power test systems.
Built on Hypertac hyperboloid contact technology, the L Series ensures low contact resistance, minimal heat generation, and excellent resistance to shock and vibration. This results in highly stable electrical performance and reduced risk of intermittent connections—critical factors in maintaining measurement accuracy and minimising downtime in high-throughput test environments.
Engineered for durability, the connectors support up to 100,000 mating cycles while maintaining low
insertion and extraction forces, making them ideal for repetitive testing operations. Features such as float mounting for blind mating, quick-disconnect jackscrews, and multiple frame configurations further enhance usability and reliability in rack-and-panel applications. Operating across a wide temperature range and supporting widely used communication protocols, the L Series provides a versatile, high-performance interconnect solution that enables more reliable, efficient, and adaptable test system design.
AEROSPACE, MILITARY AND DEFENCE PRODUCT OF THE YEAR: EZICOAX In mission-critical aerospace and defence electronics, the board-to-board interface must deliver clean, repeatable signal paths under extreme stress. Traditionally, SMP connectors have been used to meet the requirements of high-speed RF connectivity in demanding environments; however, these three-part solutions introduce mechanical and rework challenges that increase costs and can potentially compromise signal integrity. EZiCoax addresses these limitations with a spring- loaded, single-piece, solderless, low-profile coaxial interconnect (available in lengths from 3.30 mm to 18mm) that performs up to 40 GHz. It offers strong insertion loss (-1 dB) and return loss (-15 dB) performance, along with optimal 50-ohm impedance and reduced crosstalk. EZiCoax mechanical simplicity, lower mating forces (less than 5 oz per contact), and reduced stress on the boards simplify assembly and enable fast rework, minimising risk to expensive boards and reducing the need for costly, specialised maintenance. EZiCoax supports rapid repair or replacement in the field and delivers a fully compliant, highly reliable connection engineered for the most demanding conditions, while also reducing overall cost of ownership. Each EZiCoax is designed to be housed into an interposer solution, a plastic frame that aligns the connectors to the boards thanks to its built-in alignment features, such as dowel pins and bosses. The interposer mates directly with PCB interfaces and can be removed and re-installed multiple times without causing damage to the boards. Smiths Interconnect, a Molex company, currently offers standard 2-, 4-, and 8-way interposer solutions that are equipped with EZiCoax connectors. In addition, the interposer solutions can be highly customised to meet customer specifications and may incorporate digital and power contacts, enabling a complete mixed-signal solution. In high-reliability defence and aerospace systems, mechanical misalignment is common. EZiCoax uses spring probe technology for both the centre contact and shield, maintaining stable contact even under X, Y, Z, and angular misalignment. This enables more forgiving engagement and supports blind-mate approaches when access or visibility is limited.
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EZiCoax has been qualified to the requirements of ESCC 3402, Issue 5, and is designed to withstand the environmental and operational stresses typical of aerospace and defence programs. With a wide operating temperature range and specifications suited to severe shock and vibration conditions, EZiCoax interposers preserve electrical stability where conventional interconnects may loosen, fret, or drift. For space and space-adjacent applications, its low outgassing characteristics and compliance with established standards further enhance its suitability for high-reliability deployment.
PASSIVE COMPONENT / ELECTROMECHANICAL PRODUCT OF THE YEAR: HIGH RELIABLE TSX WIRE BOND FIXED CHIP ATTENUATORS
As the global demand for faster data transmission and broadband connectivity continues to grow, engineers face increasing challenges around space, power, and performance.
The High Reliable TSX Wire Bond Fixed Chip Attenuator is designed to solve these challenges by offering excellent broadband performance up to 50 GHz, while delivering increased power handling in a small 0404 wire bond package. It allows wider coverage than traditional components while providing optimised return loss for multiple frequency ranges. The HR TSX WB2 Series offers a broadband product that can be used in multiple frequency ranges, and many applications reduce the need for customers to buy multiple components. The standard parts eliminate the need for costly and time-consuming drawings and specifications as they already meet the specification.
VOTE FOR SMITHS INTERCONNECT These three nominations reflect Smiths Interconnect’s ability to translate demanding engineering requirements into practical, high-performance products. Vote for Smiths Interconnect, a Molex company, in all three Product of the Year categories and help recognise the innovations connecting today’s technology with tomorrow’s possibilities.
Smiths Interconnect
www.smithsinterconnect.com August 2026 Instrumentation Monthly
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