Introducing TESCAN S9000X


Cross-section through part of an OLED display - FoV 1.26 mm


Ultimate resolution and maximum throughput in large-scale sample preparation and characterisation


Extremely large cross-sections: New iFIB+™ Xe+ plasma FIB with high currents and unmatched FoV redefines conventional large-area cross-sectioning and slashes sample preparation time


Unveiling the most hidden features: Next generation Triglav™ UHR SEM column with improved and optimised in-beam detection system and extended imaging capabilities now including energy-filtering BSE signal collection for ultimate surface sensitivity


Challenging becomes routine: New Essence™ SW GUI for effortless, faster, and smoother operations, including collision model and customisable, application-oriented layout


Find out more at www.tescan.com


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