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Microscopy Product Vendors TESCAN


Tel: 1-724-772-7433 Email: info@tescan.com https://www.tescan.com/


TESCAN CLARA APPLICATIONS: Routine


study inspection of metal samples at and industrial the nanoscale


• Routine imaging of nanoparticles and agglomer- ates of all kinds • Analysis of beam sensitive and non-conductive materials


• Analysis of plants,


micro-organisms, and other biological specimens • Morphological and elemental characterization of geological samples


FEATURES: Unique In-Beam BSE detector designs allow filtering of signal based on energy and take off angle • Excellent for imaging of beam-sensi- tive and non-conductive samples • Fast setup of electron beam – optimal imaging and analytical conditions guaranteed • UHR Field-free charac- terization of materials at


Companies and their Products SOLARIS


APPLICATIONS: TESCAN SOLARIS is a turn-key FIB- SEM solution for the fabrication of nanostructures and nanotechnology-inspired microscale functional devices. TESCAN SOLARIS combines the most pre- cise Focused Ion Beam with UHR-SEM featuring TriLens™ immersion optics, to ensure the best pos- sible connection between ion beam milling and ultra- high-resolution SEM imaging


FEATURES: Best-in-class ion beam performance • Crossover-free ultra-high resolution SEM imaging • High precision nanopatterning engine for electron and ion beams • Multiple gas injection system options with a variety of precursor gases • Chamber extension options for up to 12“wafer inspection • Easy-to-use modular software user interface • Python scripting interface for advanced user-defined experiments


ht tps: //www.tescan.com/product / f ib-sem-for-semiconductors- tescan-solaris/


low beam energies for


maximum topography • Intuitive and precise live SEM navigation on the sample at low magnifica- tion without the need of optical navigation camera • Intuitive Essence™ software modular platform designed for effortless operation regardless of the user’s skill level


https://www.tescan.com/product/sem-for-materials-science-tescan -clara/


TESCAN AMBER X


APPLICATIONS: A unique combination of Plasma FIB and field-free UHR FE-SEM for multiscale mate- rials characterization • Optimized plasma FIB-SEM platform for high-quality deprocessing of the most modern semiconductor devices with proprietary chemistries • Milling and polishing of large cross sections • Multiscale, multi-modal FIB-SEM tomog- raphy


FEATURES: High throughput large area FIB pro-


cessing • Ga-free microsample preparation • Field- free ultra-high-resolution low energy electron beam imaging • In-beam SE and BSE detection • Opti- mized e-beam performance for high-throughput, multi-modal FIB-SEM tomography • Superior field of view for easy navigation


https://www.tescan.com/product/fib-sem-for-semiconductors-tescan- amber-x/


TESCAN AMBER


APPLICATIONS: A field-free UHR-SEM combined with the most precise FIB for sample preparation, sub-surface, and 3D analysis capabilities to take your materials nanocharacterization further


FEATURES: Ultra-high-resolution field-free SEM imaging and nanoanalysis • The highest precision micro sample preparation • Excellent low-keV ion beam performance • Multi-site FIB process auto- mation • Multimodal FIB-SEM nanotomography • Extended field of view and easy navigation • Easy- to-use modular software interface


https://www.tescan.com/product/fib-sem-for-materials-science-tescan- amber/


TESCAN UniTOM HR


APPLICATIONS: The first micro-CT system to provide sub-micron spatial resolution and high temporal reso- lution dynamic CT in a single system. • High-through- put non-destructive 3D and 4D imaging for materials research and engineering, failure analysis, and quality assurance


FEATURES: • Investigate the smallest of features


with spatial resolution down to 600 nm • Perform true 4D imaging with Dynamic CT • Implement 3D in situ experiments • UniTOM HR's high-power source (50W), multiple detector options (up to 3) and heavy load stage (45 kg) accommodates samples up to 500 mm diameter X 700 mm high • Maximize system utilization and throughput


https://info.tescan.com/unitom-hr-micro-ct?hsLang=en


www.cambridge.org/mto


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