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TEMPERATURES Structural adhesives suitable for bonding components exposed to temperatures up to 220˚C are new from DELO. According to the company, adhesives

resistant to elevated temperatures are in demand in mechanical engineering and the automotive industry, for example

for electric motors. Here, they need to prove high strength and permanent resistance to environmental influences, such as gear oil. However, the strength of adhesives is highly dependent on the temperature – many adhesives exhibit a strong performance drop at temperatures above +150˚C. The high-temperature adhesives have an increased shear strength of 12 MPa

at high temperatures. Thanks to an increased glass transition temperature and an improved long-term temperature stability, up to 3N/mm2

are possible even

when the bonded connection is subjected to +220˚C, the company states. The tensile strength after intensive tests, in which the adhesive is stored at a temperature of +220˚C for 1,000h, is still above 80% of the initial value. The adhesives’ mechanical properties open up versatile application possibilities

in mechanical engineering. For example, DELOMONOPOX HT282 with aluminium filler is used for bonding magnets in electric motors as it can withstand dynamic stress thanks to its high impact resistance. In contrast, DELOMONOPOX HT281 with mineral filler is electrically insulating. This product bonds and casts components in electric motors, and can also be used in applications where excellent chemical resistance is required – for example, slide ring seals. Tried and tested processing properties enable simple and fast dispensing.


Fujitsu’s mini-ITX mainboard D3313-S supports AMD Eyefinity technology. According to the company, the integrated AMD Radeon GPU used by the device supports two independent display outputs simultaneously. Combined with AMD Eyefinity technology enabled graphics

cards, up to six independent displays can be connected. As a result, system designers can connect several high-resolution displays, configured in combinations of landscape and portrait orientations, to achieve a large integrated display surface that enables windowed and full-screen 3D applications, images and video to span across multiple displays as one visual plane. Designers can also utilise AMD Eyefinity to architect multi-display configurations that present multimedia content on each screen. The mainboards produce little heat, allowing the design of fanless systems which are compact and quiet. As a result, the D3313-S is suitable for digital signage applications. It is available in three versions, each with a different AMD Embedded G-Series system on a chip (SOC). The mainboard also offers four PCIe lanes for mounting additional graphics cards to drive up to six displays.


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