ADVERTISEMENT Fully Converged, Scalable Solution for an Intelligent Edge


The solution is optimized for 1U and 2U rack environment, including a new 1U solution for 12x 3.5” hot-swap drive and 2U solutions


for 24x 2.5” hot-swap drives. Features include


redundant high efficiency power supplies, specially designed optimized cooling, and dual PCIe 3.0, Mini PCIe/mSATA and M.2 expansion slots for superior network and additional storage options.


Supermicro Embedded Building Block Solutions:


Lowest TCO for hyper-scale cloud workloads, storage, communications and security devices.


With the enormous growth of data and connected devices in mobile networks, carriers require a fully converged and scalable high-performance solution at the intelligent edge. Supermicro is helping carrier providers address these edge convergence needs by introducing a converged yet scalable building block solution with


the new X10SDV-7TP8F intelligent embedded/server


motherboard design. Designed expressly for consolidating infrastructure


at the edge, this optimized solution offers exciting


possibilities when paired with the latest Intel® Xeon® processor D product family. The combination brings new performance, density, low power consumption, and cost savings to a variety of compute, storage and networking workloads.


Figure 2: Supermicro® SC216 2U with 24x 2.5" and Supermicro® SC801 1U with 12x 12 3.5"Hot-Swap Drives


Powered by the Latest Intel® Xeon® Processor D Product Family with up to 16 Cores The


high-density hyper-scale Supermicro X10SDV-7TP8F


provides scalable performance when paired the Intel® Xeon® processor D product family. Based on Intel’s 14nm process technology, these processors couple lower power consumption with the performance of up to 16 cores. The processor family enables new options for infrastructure optimization, bringing the performance and advanced intelligence of Intel® Xeon® processors into dense, lower-power SoCs. These powerful SoCs include improved cache sizes and support up to 128G DDR4 ECC Registered memory. Other advanced processor features include Intel® Virtualization Technologies (Intel® VT-x, VT-d and SR- IOV); Intel® AES New Instructions (Intel® AES-NI); Intel® Trusted Execution Technology (Intel® TXT); Intel® Advanced Vector Extensions 2 (Intel® AVX2); Intel® QuickData Technology, silicon-based reliability, availability and serviceability (RAS); and Dual 10GbE Network Controller.


Built for Embedded Server Appliances and Edge Systems The Supermicro X10SDV-7TP8F is a highly scalable, compact, energy-efficient design that provides outstanding performance for: 


Lightweight hyper-scale workloads – dynamics web serving, memory caching, and dedicated hosting


 Dense, low-power storage workloads – warm storage and video-on-demand


Figure 1 Block Diagram of the Supermicro® X10SDV-7TP8F Flex ATX motherboard


Supermicro converged infrastructure for the edge: With its server-class capabilities, the Supermicro X10SDV-7TP8F offers the industry’s most converged infrastructure and a low total cost of ownership (TCO) to a wide range of embedded applications. The X10SDV-7TP8F is a small Flex-ATX form factor solution providing up to 22x storage devices


(16x 6Gbs


SATA3/SAS2 ports, 6x SATA3 ports), 8 LAN ports (including Dual 10GbE fiber connectivity), and IPMI for remote management.


 Communication workloads – wireless base stations, routers, switches, security and network appliances that require hardware-assisted virtualization, acceleration, and integrated networking


Find Out More Discover how the Supermicro X10SDV-7TP8F building block solution provides performance for next generation embedded, industrial IoT, enterprise and cloud server appliances. Learn more at: www.supermicro.com/Embedded.


Intel and Xeon are trademarks of Intel Corporation in the United States and other countries. Supermicro is an Associate member of the Intel® Internet of Things Solutions Alliance.


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