This page contains a Flash digital edition of a book.
The SPAM project (Supra-disciplinary approach to research and training in surface Physics for Advanced Manufacturing) aims to bring together a team of promising researchers and supply them with the training required to advance in the field of surface physics. This will help usher in the breakthroughs required for optical lithography technology in order to be able to print features under 32nm for advanced semiconductor manufacturing. The training project will materialize in the


form of an ITN (Initial Training Network) governed by Marie Curie. The overall cost of the project is €4.3 million with €2.7 million of that going towards salaries and the remainder going towards other costs such as research training,


travelling, conferences


and management activities. The European Commission has guaranteed the funds for the four year duration of the project. The recruited researchers will be trained


by a pool of 12 renowned European partners who are respected experts in the field of surface physics and technologies. The partners will


act as mentors towards


individual researchers and assist them by applying a range of modules with set goals relating to their individual disciplines. These disciplines vary a vast amount, and include


advanced lithographic systems,


vacuum technology, high performance optical systems, micro and nano- electronics, nano-technology, applied optics,


surface physics, analysis and more. “When we started considering advancing


“Young researchers have gained further research training which helps them to develop their research skills and supports them in their research career”


The Supra-disciplinary Research Teams


(SRT’s) are split into four areas and are supported by five distinctive Training Exchange Pools (TEP’s). These are; surface conditioning and modification, surface/ interface metrology, surface conditioning and preparation, supporting science areas and complementary competence training. The SRT’s each have a unique, main research focus. The first SRT focuses on


94


our technologies here in 2007, we could only scan at around 0.5 m/s. So we needed to find people who could help us find a new limit for immersion. We also wanted to develop a new hydrophobic coating. This new type of coating would allow us to reach far higher scan velocities. These are the main aims of our leg of the project.” said Michel. The second SRT is surface cleanliness


which focuses on condensing contamination at times when multilayer mirrors are exposed to extreme ultra violet light. In these cases, condensable hydrocarbons lead to carbonisation, so the SRT must set extreme rules for controlling them. The main aim for the team is to gain a deeper understanding


of the contamination


process and subsequently, limit the impact of the process as best they can. “This has major implications for industry


as our lithography machines involve optics which should last for about 7 years and if they don’t, that is not good value for money


When the surfaces of the table are too smooth, the tables tend to adhere the wafers too early. During manufacturing the tables are finely polished in order to get the perfect flatness. The SRT3 researchers aim at reducing the resulting unwanted adhesion either through imposing a well- defined roughness or by changing the surface energy of the surfaces. SRT-leader Edwin Gelinck sees good


possibilities in using the results of their work in fields where placement and accuracy of surfaces is very important. “In many areas adhesion is an unwanted phenomenon, e.g. in mechatronics and the MEMS industry,” explains Gelinck. “Research institutes such as TNO (the Netherlands organisation for applied scientific research) can apply the results of the current work in these fields as well,


leading to important spin-offs from


our work.” The fourth and final SRT is metrology of


structured surfaces. The ambition of this SRT is two-fold: on the one hand, to extend the application range of ASML’s metrology


Insight Publishers | Projects


contact line (in)stability. This element hopes to provide a better understanding of contact line dynamics - this is the line between water and air below the lens. This team which is coached by Michel Riepen has the task of studying flow phenomena in a complex environment with non-ideal fluids for immersion lithography system. They wish to increase the wafer scan velocity, which also requires higher wafer accelerations of more than 30m/s2.


for our customers. So now we’re using cleaning methods which limit contamination issues and will increase the life spans for these machines” says Maarten Van Kampen. “Our biggest question is; what is the key


source of contamination on these surfaces and how do we remove them?” The third SRT, entitled ‘Controlled Surface


Roughness’, is aimed at decreasing adhesion between the wafer table and the wafer.


applied surface


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54  |  Page 55  |  Page 56  |  Page 57  |  Page 58  |  Page 59  |  Page 60  |  Page 61  |  Page 62  |  Page 63  |  Page 64  |  Page 65  |  Page 66  |  Page 67  |  Page 68  |  Page 69  |  Page 70  |  Page 71  |  Page 72  |  Page 73  |  Page 74  |  Page 75  |  Page 76  |  Page 77  |  Page 78  |  Page 79  |  Page 80  |  Page 81  |  Page 82  |  Page 83  |  Page 84  |  Page 85  |  Page 86  |  Page 87  |  Page 88  |  Page 89  |  Page 90  |  Page 91  |  Page 92  |  Page 93  |  Page 94  |  Page 95  |  Page 96  |  Page 97  |  Page 98  |  Page 99  |  Page 100  |  Page 101  |  Page 102  |  Page 103  |  Page 104  |  Page 105  |  Page 106  |  Page 107  |  Page 108  |  Page 109  |  Page 110  |  Page 111  |  Page 112  |  Page 113  |  Page 114  |  Page 115  |  Page 116  |  Page 117  |  Page 118  |  Page 119  |  Page 120  |  Page 121  |  Page 122  |  Page 123  |  Page 124  |  Page 125  |  Page 126  |  Page 127  |  Page 128  |  Page 129  |  Page 130  |  Page 131  |  Page 132