Title
Association & institutes news
Association & institutes news
Published within one week of the close
of each quarter’s survey, the Global EMS
Statistical Program reports will be available
only to participating companies. Partici-
Medical electronics symposium call
Two industry veterans receive ipc’s
pants are asked for their commitment to
for presentations
2009 hall of Fame award complete the quarterly surveys for one
The SMTA and MEPTEC are pleased to
In recognition of extraordinary contri- calendar year, so that a consistent sample of
announce the combination of their 2009
butions to the IPC and the electronic participating companies can be maintained
Medical Electronics Symposia. The two-day
interconnect industry, countless hours throughout the year.
technical program will be held September
of volunteer service on IPC standards Participation in the Global EMS Statis-
23-24, 2009 in Phoenix, AZ. ASU’s Col-
development committees, and exceptional tical Program is free for IPC member com-
lege of Nursing and Healthcare Innovation
lifetime achievement, IPC — Association panies. Potential participants are invited
will co-sponsor this event.
Connecting Electronics Industries® to contact Ms. Piyamart Holmgren at IPC,
Conference chairs Dale Lee (Plexus
bestowed the 2009 Raymond E. Pritchard
homupi@ipc.org. Nonmember companies
Corporation), Nick Leonardi (Premier
IPC Hall of Fame Award to Bill Jacobi, may join the program for a fee of $1200
Semiconductor Services), Ron Molnar (AZ
former president and CEO, William Jacobi (U.S.) per year or by joining IPC. Annual
Tech Direct), and Dave Ruben (Medtronic
and Associates, and Dan Feinberg, owner, IPC membership dues are from $600 to
Microelectronics) cordially invite you to
Fein-Line Associates. Presented at IPC $1000 per year, depending upon company
submit an abstract for consideration.
APEX EXPO™ in Las Vegas, the Hall of size. To learn more about IPC membership,
This symposium will focus on medical
Fame Award represents IPC’s highest level visit
www.ipc.org/membership.
electronics and medical device applications.
of member recognition.
The technical committee is soliciting ab-
For more information on the IPC Hall
stracts from within the medical community
of Fame and other awards presented at IPC
that will share the most up to date informa-
APEX EXPO, contact Anna Garrido, IPC
tion about company electronics expertise,
director of marketing and communications,
practices, technology and applications as it
at +1 847-597-2804 or
AnnaGarrido@ipc.org.
iMaps and seMi announce a topical
relates to the symposium topics.
workshop on wire bonding
Please provide an abstract (250 word
New ipc statistical program to track
The Wire Bonding Workshop will be held
minimum) on any of the symposium topics
worldwide eMs financial metrics
Monday, July 13th at the San Francisco
or other relevant topics to the conference
IPC—Association Connecting Electronics
Marriott Hotel in San Francisco, Califor-
coordinator, Melissa Serres Marx via email
Industries® launched its new Global EMS
nia. The event will run prior to SEMICON
to
melissa@smta.org no later than May 29,
Statistical Program to measure and track fi-
West 2009—July 14-16. The early registra-
2009. There is no technical paper require-
nancial metrics quarterly for the worldwide
tion deadline is June 19, 2009. Housing
ment for this symposium. Presentations are
electronics manufacturing services (EMS)
Deadline: June 29, 2009.
due on September 1, 2009.
industry. The surveys and reports will be
The objective of the Wire Bonding
available in English and Chinese.
Workshop is to have a unique forum that
The surveys will collect data confiden-
brings together scientists, engineers, manu-
tially from a large sample of EMS compa-
facturing, academia, and business people
2009 iNeMi roadmap available
nies worldwide on key financial and opera-
from around the world who have been
The International Electronics Manufactur-
tional performance metrics, such as sales,
working in the area of Wire Bonding. The
ing Initiative (iNEMI) has made its 2009
orders, pre-tax earnings, cost of goods sold,
workshop has been specifically organized
Roadmap available for sale. This latest
inventory days of supply, cash-to-cash cycle,
to allow for the presentation and debate
roadmap covers five product sectors and 20
and return on value added. The aggregate
of leading edge Wire Bonding Technology
different manufacturing, component/sub-
results, along with analysis of trends and
and Applications.
system, design, and business process tech-
indicators, will be published in quarterly
The IMAPS Topical Workshop is
nologies. New in this edition are chapters
reports only for companies participating in
being run at the San Francisco Marriott
on photovoltaics, solid state illumination
the program. Results will be broken down
Hotel, in conjunction with SEMICON
and RFID item-level tag (ILT).
by region and by company size wherever
West. To book online, please visit the
The 2009 Roadmap was created by
possible, provided that statistical integrity
official housing site at https://www.
more than 550 individuals (the largest
and confidentiality will not be compro-
cmrhousing.com/SEMI_S5/HotelList.aspx
number of participants to date) from 250
mised.
or call the SEMICON West Housing
organizations located in 18 countries on
IPC conducts its online surveys using
Office at 1.800.421.2499 (US & Canada)
four continents. The cost of the roadmap
a secure server and adhering to strict
or 1.415.979.2287 (International). Please
is $250 for non-members ($325 outside
confidentiality policies. IPC publishes only
reference SEMICON West when making
North America). For more information
aggregate data; no company-specific data is
reservations by phone.
and to order, go to
www.inemi.org/cms/
shared.
roadmapping/2009_Roadmap.html.
44 – Global SMT & Packaging – June 2009
www.globalsmt.net
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51