From the inside: STI Electronics
YOUR EMS
SOLUTION!
RAPID ��DAY PRODUCTION ASSEMBLY
TOTAL PRODUCT REALIZATION
ENCAPSULATION � POTTING � CONFORMAL COATING
TESTING � MECHANICAL ASSEMBLY � UPFITTING �BOX BUILD�
ELECTRONIC AND MECHANICAL
DESIGN / DEVELOPMENT / LAYOUT
Figure 6. Plenty of room for expansion. The manufacturing floor shows two produc-
tion lines with space for another 4-6 lines.
COMPLETE LIFE CYCLE MANAGEMENT
GLOBAL SUPPLY CHAIN MANAGEMENT
RAPID AND PRODUCTION THROUGH ONE SOURCE
QUALITY CERTIFICATIONS
ISO ����:���� ISO/TS �����
MIL�PRF������/� & � AS ���� REV B
TL ���� REV �.� FDA/GMP ����
www.divsys.com • 317-299-9547 x 169
array of equipment have indicated that they would license this
for component level technology, subject to reaching agreement
testing and system on its implementation.
Figure 8. Marietta Lemieux and Mark McKeown in the microelectronics
level testing, includ-
laboratory.
ing strain gauge In conclusion, this is one of the largest
testers, bond and and most impressive new factory openings
machine with two pots, one SAC305 and
sheer testers, data I have seen in the United States in recent
the other SnPb 63/37. It has also handled
loggers and testers for conformal coatings. years. The business model is perfectly
complex hybrid boards, up to 48 layers.
The cleanroom is where STI assembles complemented by receiving reduced costs
Production manager Mel Parrish is
its patented embedded component die on materials through its distribution arm,
one of STI’s oldest employees. Joining STI
technology. This is an active device that is the ability to identify and hire the best en-
back in China Lake, Mel worked on the
embedded into the substrate and capped gineers through its training school and the
industry’s first look-up, look-down system,
with a lid, saving real estate on the board extensive capabilities of its laboratories to
which was pioneered by IBM and a precur-
and considerable cost. confirm and maintain the highest levels of
sor to the SMEMA standards. Mel’s goal
The devices are plasma etched prior reliability and mission critical components
at STI is to achieve the highest first-pass
to bonding and vacuum baked to remove leaving the factory.
yield, resulting in low amounts of rework.
moisture from the substrate. A Datacon
He plans to add more test equipment in
die bonder handles the dispensing and die Trevor Galbraith.
the near future and establish a final box
bonding using an ultrasonic wedge bonder.
build line to widen the range of work they
The system can accommodate bonds from
can accept.
1 µm up to 20 mm for power devices.
The benefits of the embedded com-
Microelectronics laboratory
ponent die technology are that it reduces
The final stage of our tour took us to the
the number of solder joints, increasing
microelectronics laboratory, run by the
reliability and it drastically reduces the real
highly knowledgeable Casey Cooper. At
estate on the board. Any heat generated
the heart of the lab is a 900 sq. ft. class
by the embedded device is taken away
1,000 cleanroom. The lab is armed with an
by the thermal core in the substrate. STI
www.globalsmt.net Global SMT & Packaging – June 2009 – 31
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