Title
of conformal coatings, resins, lubricants of the MY100 family is smaller footprint VI also introduced a new “super resolu-
and cleaning materials. The company has and is fitted with dual 8-pipette multi-pick tion” camera with an FOV of 26 µm and
manufacturing facilities in Beijing and heads producing 43,000 cph. Like its larger a resolution of 13 µm. The camera is ideal
Derbyshire, England. They are planning stablemate, the MY100SX, it is fitted with for inspecting 01005 devices and can be
to launch around eight new products at linear motors and encoders and has a 160 retrofitted to existing machines with a
Productronica later in the year. feeder capacity. software upgrade.
MIRTEC demonstrated their new Interestingly, MYDATA also reported That was all from Shanghai this year.
solder paste inspection (SPI) system and sales of the MY500 jet printer are perform- We have one more year in the Everbright
the Intellisys software package to China for ing strongly. The printer is particularly Convention Center before NEPCON
the first time. The company also said they attractive for high mix prototyping and moves to the new state-of-the-art facility
saw signs of recovery among Korean and short-run applications. The lack of stencils across town. By then we should have a
Chinese manufacturers. means the machine has a short ROI. clearer picture of how the Chinese elec-
KIC coined a new phrase, RPI (Reflow Siemens reported a very strong tronics manufacturing market is develop-
Process Inspection), which they claim is a February, March and April sales period ing and what its long-term role will be in
perfect complement to AOI, SPI and x-ray in China, mostly based on the new 3G the global electronics community.
and an essential part of an overall test strat- licenses issued by the Chinese government Trevor Galbraith.
egy. The KIC 24/7 monitors and reports and the anticipated spike in consumer
on the reflow profile of BGAs and array sales of 3G phones. Siemens SEAS also
packages, warning the operator when these debuted the Multistar placement head
boards/components drift out of spec. that is designed for the D-Series machines
Kyzen claim the number of applica- and offers greater component flexibility,
tions are rising as the determination to negating the need for a special odd-form
clean is no longer limited to high reliability machine after the chipshooter.
products but is also now expanding to the VI Technology launched a new selec-
cosmetic appearance of consumer boards. tive 3D AOI system that can concentrate
Customers have greater confidence in on areas of interest on the board without
products with a clean appearance. any loss of cycle time. The system can
MYDATA introduced the MY100DX check co planarity and has been used to
to the China market. This latest version find dropped chips under array devices.
www.globalsmt.net Global SMT & Packaging – June 2009 – 33
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