Title
Show roundup: SMT/Hybrid/Packaging beats the recession
Show roundup:
SMT/Hybrid/Packaging
beats the recession
Just like 2001, SMT/Hybrid Packaging in Nuremberg, Germany, May
5-7th retained its title as the most resilient exhibition in the electronics
calendar. If there was as recession going on, there certainly was no sign
of it here.
The total floor space was the same as 2008, Flexible circuit applications are rising the tacky quality stronger and acts as a
and pre-registrations were up 20%. The faster than rigid boards, and Lang predicts thickener. Finally, Heraeus are now success-
show kicked off with an official press con- a bright future for roll-to-roll substrates. fully mass producing spheres < 100 µm.
ference hosted by Udo Weller, the division Lang explained that further improvements Pfarr Stanstechnik exhibited a new
head for Mesago Messe Frankfurt GmbH, will come from materials science and felt range of high purity gold products on
and featured presentations by Profesor that more work was need on board finishes ceramic substrates for use in high reliability
Herbert Reichl, Klaus Dieter Lang and Dr such as Ag. applications such as pacemakers.
Randolph Schliesser from Future Packag- On the show floor, the biggest news Siemens revealed a new sales strategy
ing. Hr Volker Pape also gave the latest came from Heraeus, who acquired Umi- which focuses on selling capacity—not
development from the VDMA. core AG. Umicore is the global leader in machines. Customers can choose the base
Professor Reichl presented “Trends die attach and tacky flux, with production number of gantries, heads and feeders they
in system Integration,” highlighting 3D plants in Hannau and Singapore. The ac- need for normal production and then rent
assembly, flexible circuits and LEDs as the quisition was a perfect complement to the additional capacity at peak times, e.g. for
areas that will see future growth. In par- Heraeus paste and bonding wire divisions. the Christmas market. Siemens have now
ticular, high brightness LEDs are projected On the product front, Heraeus were completed their carve-out from Siemens
to double by 2010 from €4 billion to €8 reporting success with their InnoLot SAC Drives & Technologies Division and now
billion as a raft of new applications come alloy, which has greater reliability at higher report directly to Siemens AG.
to the market. operating temperatures (up to 150°C). The Koh Young at last confirmed the name
Klaus Dieter Lang focused his presenta- company also introduced dippable paste—a of their new 3D AOI system. It is called
tion on process technologies. Dr Lang welcome product that uses fine particles the “Zenith” and relates to the machine’s
forecast an acceleration of active and pas- instead of tacky flux. The particles increase Z-height inspection capabilities.
sive devices being integrated into boards. the height of the standoff, but this makes Systronic revealed the new Stencil
34 – Global SMT & Packaging – June 2009 www.globalsmt.net
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