Contents
Award Winning Products and Service
Volume 9, No. 6
June 2009
American edition
Global SMT & Packaging
is published monthly
by Trafalgar Publications
Contents
Limited. The journal is FREE
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2 Getting ready for a long, hot summer 14
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14 Energy measurement: The main metric for high strain rate
26
07001.
bond testing of solder balls
No part of this publication Dr. Stephen Clark, Dage Precision Industries
may be reproduced, stored in 24 A revolution in wave soldering
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Peter Grundy, ITM Consulting
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26 Interview—Bill Schreiber, Smart Sonic Stencil Cleaning
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28 From the inside: STI Electronics
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32 NEPCON China sees first green shoots of recovery
The opinions expressed in the
34 SMT/Hybrid/Packaging beats the recession
articles are not necessarily those 35 MYDATA positions itself for strong growth
28
of the editors or the publisher. 46 Case Study: A successful model for PCB fabrication in an
ISSN No. 1474-0893
ever-changing market
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4 IC packaging technology retrospective— 7 Industry News
part 4 36 New Products
Joe Fjelstad 42 Global SMT & Packaging Online
44 Association News
18 Sobering first quarter—Modest seasonal & 48 International Diary
cyclical recovery now underway
Walt Custer and Jon Custer-Topai
MV-3 Desktop AOI Series
MV-7 Inline AOI Series
“All their [compliance] work was
rendered useless as the label that
boasted their work was the area
3 MORSE ROAD • OXFORD, CT 06478 of non-compliance.”—page 10.
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