TECHNOLOGY IN ACTION
New Highly
Compliant Gap Filler Takes the Heat without Adding Stress
he Bergquist Company has combined high thermal conductivity with high conformability in its latest Gap Pad® HC 3.0 gap filler, creating a high-performance thermal material for applications where low assembly stress is a must. Hard-working components such as ASICs and DSPs can now run cooler in electronic equipment such as telecom linecards and consumer products, using the new highly compliant Gap Pad HC 3.0 to eliminate insulating air gaps without placing excessive stress on the PCB or fragile component I/Os. Gap Pad HC 3.0 can also be inserted between electronic modules and heatsinks to maximise thermal dissipation. The gap filler is available in sheet form or as die-cut pads in thicknesses from 0.508mm to 3.175mm. Gap Pad HC 3.0 achieves low thermal impedance at low pressures by combining a unique 3.0 W/m-K filler package and low-modulus resin.
T
The Bergquist Company Tel: +49 4101 803286 Web:
www.bergquistcompany.com
enter 820
Welcoming Computer Components Inc. Newest member of the Comus Group of companies
C
omus International, Corporate headquarters of
The Comus Group of Companies, is
pleased to announce the recent acquisition of Computer Components Inc. (CCI), located in East Granby, CT.
For over 30 years CCI has been a pioneer in the manufacturing of replacement for obsolete, hard to source, and special requirement reed relays.
Their skilled techniques and abilities are what give them a competitive edge in servicing their customers with a product that not only meet the application requirements no matter how custom it may be; but also with some of the fastest response times in the industry.
This addition to the Comus family works very well with our already expansive reed relay and sensor product lines. The CCI staff has an
Comus Europe Ltd Tel: 01255 862236
Sick’s Miniature Capacitive Sensor packs a big non-contact ‘Punch’
ICK UK has launched a versatile miniature capacitive proximity sensor with the capability to perform a wealth of non-contact sensing tasks in electronic assembly applications including production, packaging and level sensing. The CQ4 has a rapid switching frequency up to 100 Hz and a sensing range of up to 8 mm, making it ideal for high-speed object detection through non- metallic surfaces. The CQ4 can reliably detect wafers in the different production steps in electronics and solar manufacture.
S 9-way AT Circular Series Because it can detect
through non-metallic surfaces it is also suitable for fill level monitoring of liquids, powders and solids.
Phil Dyas SICK (UK) industrial sensor specialist explains: “The CQ4 is no larger than a couple of cubes of sugar with the sensitivity and rugged construction to be used almost anywhere where you might have struggled to find the space to install a sensor before. “Because the CQ4 is a capacitive sensor with a range of up to 8mm through non-metallic materials,
it can ‘see’ through packaging and you don’t have to cut a hole in a pipe or vessel wall for example, so there are no sealing issues. Often non-contact sensors are fastened with cable ties to a plastic pipe or a container wall and the CQ4 has a helpful mounting groove at the back to ensure the sensor remains securely in place. “At the same time it is easy to adjust the sensitivity and range for optimum detection performance, with a potentiometer control. The CQ4 is very easy to set up and commission and the wide choice of switching output options and connection configurations give the engineer plenty of scope for optimising selection to match the production specifications.” The new SICK CQ4 capacitive sensor is contained in a 39.5 x 12 x16mm highly-durable fibreglass mounting with IP67 protection and the integral metal fastening threads ensure secure connection under industrial use conditions. With rapid 100Hz switching, it is able to provide real time detection to match application changes for precise production control and feedback.
SICK Tel: 01727 831121 Web:
www.sick.com / ELECTRONICS enter 822 A
mphenol Industrial Products Group, a global leader in interconnect systems, has enhanced its
9-way AT circular series receptacle line by adding a smaller flange version that can be fitted to all heavy equipment vehicles. The ATC-09-9-1939PN meets SAE J1939, a specification for communication and diagnostics among industrial vehicle components. Used as a diagnostic connector in demanding applications found on construction and farm equipment as well as in heavy-duty trucks, these round receptacles include a strain relief for the wires coming out of the back of each unit and a wave spring for higher vibration applications. The enhanced heavy duty connectors feature a simple jam nut mounting for quick assembly and a smaller flange to save space on mating panels. They are corrosion resistant and environmentally sealed against moisture and contaminants as well as being water resistant up to three feet.
Amphenol Industrial Operations Europe Tel: +39 02 93254.204 Web:
www.amphenol-industrial.com
ELECTRONICS | OCTOBER 2014 39
impressive total combined reed relay experience of over 150 years servicing and growing their client base.
With this addition, Comus gains a new level in flexibility and product offering, an increased product portfolio for our customer base, continued evolvement and expansion of our Global manufacturing synergy between our existing divisions, and most importantly a new level of service and customer application troubleshooting for reed relays.
The Comus team is excited to see the benefits of this new alliance as we begin to work with the CCI customer base as well as offer our customers the products and service abilities from CCI.
We look forward to having them join our team to help grow our business together so that we may always endeavor in our continued mission of “Sensing the World’s Needs.”
Web:
www.comus-intl.com enter 821 enter 823
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