Independent distribution I Distribution


Retronix develop exciting new deballing process


Retronix Ltd, with its HQ in Glasgow and sites in North America and Asia, have developed an exciting new process as part of their reballing process that removes any issues in relation to potential damage to device substrates. The non-contact Desoldering stage – which is being highlighted at Productronica in Munich in November 2011, is the final step in taking Retronixs reballing process to the highest level possible. After listening to their High Reliability customers, there are concerns over possible substrate damage that can trap fluxes, cleaning solutions etc when conformal coating is applied. Laser reballing use for the sphere attach process has already been seen as the safest process in the market. Now, with a completely, non-contact, deballing process – the circle is closed and prevention of these scratches is now in place.


www.retronix.com www.cieonline.co.uk


Components in Electronics


November 2011 23


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