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Linear Technology I Focus The device’s high level of integration


results in a simple, clean, tightly regulated application solution to the traditional challenge of isolated power delivery.


Electronic packaging Increasingly electronic packaging is shrinking meaning that nearly every customer is looking for more power and functionality but in an ever smaller form factor. However, this requires designers to balance thermal considerations with hot and power-hungry devices. Products in the future will need to be highly efficient in order to manage thermal issues in demanding military, avionics, and other high-reliability electronics systems because the more efficient the product, the less heat that will need to be extracted and for military devices the ability to operate in extreme conditions can be crucial. Linear’s power Modules have been developed to offer a simple but robust power supply solution. With an enhanced thermal and electrical design these modules look to optimise size, weight and power, reduce design time and allow designers to focus on the core IP. Linear is significantly expanding the family and they are being used not only in multi-output power management solutions but also in RF and baseband applications and monitoring and control.


Linear has been developing these types


of products over the past four to five years and is now facing growing competition from competitors who are looking to enter this market for packaged technology. There is also a growing push towards


COTS solutions especially at a time when military budgets are under pressure and the military is looking to reduce the technological risks they are exposed to. The problem is that too often these types


of devices are unable to handle the extreme conditions military equipment are expected to operate in. For Linear Technology this demand for COTS is going to require even greater


efforts in terms of innovation - simply put it’s going to have to deliver more products that appear simple on the outside but are increasingly complex inside. ■


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Components in Electronics


November 2011 19


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