What’s New
RS-485 transceiver integrates transformer driver
Texas Instruments Inc. (TI) offers an isolated half-duplex differential line transceiver with an integrated transformer driver. TI touts that the ISO1176T, together with an external transformer, rectifier and regulator, provides the smallest isolated signal and power system design with the highest efficiency and lowest electromagnetic interference (EMI).
Applications include Profibus systems, factory
and building automation, networked sensors, motor/motion control, HVAC, and networked security stations.
By integrating the transformer driver in the
transceiver, the ISO1176T, housed in a 16-pin SOIC package, enables component reduction and board space savings of 20 percent compared to competitive solutions, said TI. It also operates at 40Mbits/s ormore than twice that of the nearest competitor, enabling faster data transmission, said the chipmaker.
TI also said its capacitive isolation technique,
which uses SiO2 as an isolation dielectric increases reliability and lifetime bymore than double that ofmagnetic or optical isolation techniques. The device supports 160 nodes, reducing the number of repeaters required and systemcost.
www.ti.com
Spansion flash memory delivers faster speed in smaller package
Spansion Inc. has expanded its GL-S product line that it touts as the industry's fastest family of NOR Flash memory devices for automotive, consumer electronics, and gaming applications. Designed for fast data access, interactivity and boot performance, the Spansion GL-S family enables electronic devices to start nearly instantly with the push of a button, said Spansion.
The GL-S family now offers densities of 128-Mbit, 256-Mbit, 512-Mbit, 1-Gbit and 2-
Gbit for applications including automotive in-cabin electronics, consumer electronics, gaming, set-top box, telecommunications and networking.
The GL-S family also is said to deliver up to a 45 percent performance advantage
over competing NOR products. The programming speed of the GL-S is two times faster than legacy GL products and 30 percent faster over the competition based on third- party benchmarks, said Spansion. This translates into faster throughput in manufacturing lines and lower costs.
The devices are available in a 40 percent smaller BGA package (9 x 9-mm) for space-
constrained applications. Samples are
available.Mass production will begin in the second quarter of 2011.
www.spansion.com ESD protection ICs reduce parts count
Devices (IPAD) technology, enablesmanufacturers to reduce parts count and simplify the design of high-speed data circuits commonly used in smart phones, tablets andmobile computers, as well as for wired connections such as USB2.0 and HDMI.
Common-mode filtering prevents data errors caused by
electromagnetic interference (EMI), and is usually implemented using a separate ceramic-type component, said ST.
In comparison, ST's new single-chip solution is said to save up to
50 percent of printed-circuit-board (PCB) space thanks to the company's new filter technology.
The single-channel ECMF02 and the two data-channel ECMF04,
STMicroelectronics has claimed the industry's first silicon-based ICs to combine common-mode filtering and electrostatic discharge (ESD) protection needed by high-speed data lines. The ECMF02 and ECMF04 devices, based on ST's Integrated Passive and Active
42 |March 2011
with a 6-GHz differential bandwidth, comply with HDMI,MIPI D- PHY and USB2.0. The devicesmeasure 0.55-mmhigh and are available in uQFN packages.
www.st.com www.electronics-sourcing.com
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