Infineon Technologies and Fairchild Semiconductor announced a packaging partnership for their power MOSFETs in the Infineon PowerStage 3x3 or Fair- child MLP 3x3 (Power33™) packages.
ith immediate availability, Intrinsiq Materials announce the launch of ‘Intrinsiq CI’, a stable,
cost effective 12wt% copper ink formulation desi- gned for photonic curing at room temperature in air.
The ink is the first product in a range of ink formu- lations for use with industry standard commercial inkjet systems on a variety of substrates including paper, polyimide and FR4, producing conductivities typically comparable to commercial silver inks with significantly higher metal loadings. Pack sizes ranging from 50ml upwards are available directly from Intrin- siq Materials, Farnborough. Sales & Marketing Direc- tor, Ian Clark states “there has already been substan- tial early interest in the ink, with numerous end users already assessing trial quantities in a wide range of applications, including military, aerospace, RFID, PV metallisation, printed circuit boards and packaging.
The potential for using low cost copper with high speed industry standard inkjet printing and low cost photonic curing is a highly attractive combination.” Larger production quantities will be available from mid-2010 as production scaling is implemented. Intrinsiq’s COO, Richard Dixon, will oversee the process:
“Intrinsiq’s strength here is our proprietary plasma production system which gives us the ability to de- sign, manufacture and functionalise the nanoparticles together with our expertise in dispersion and ink
formulation – control over all the production steps is key.”
LA-Tencor Corporation (NASDAQ: KLAC), a provider of process control and yield manage-
ment solutions, announced operating results for its third quarter of fiscal year 2010, which ended on March 31, 2010, and reported GAAP net income of $57 million and GAAP earnings per diluted share of $0.33 on revenues of $478 million.
Corporation (NASDAQ: KOPN), the largest U.S. manufacturer of display systems for mobile
consumer and military applications, has received a $27M follow-on production order of eyepieces for the U.S. Army’s Thermal Weapon Sight Bridge (TWS-IIB) program. This order, to be fulfilled over a two-year period, supports continued production of a high-performance eyepiece that has been fully quali- fied recently in the TWS-IIB program after thorough testing in harsh battlefield environments. The same eyepiece is being demonstrated at the International Defense, Security, and Sensing Symposium in Orlan- do, Florida this week.
“This follow-on order from one of our customers is a testament to the quality of our display system pro- ducts,” said President and CEO Dr. John C. C. Fan. “The combination of our advanced display technolo- gy with our proprietary electro-optical system design and manufacturing processes, which include mini- mizing the generation of and screening for foreign particles and extensive testing for shock, vibration and environmental stress, results in the industry’s most robust thermal weapon sight eyepiece.”
10-04 :: April 2010