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photovoltaic (BIPV) market place utilising Pilkington’s TEC series of transparent conductive oxide (TCO) coated float glass and Dyesol’s dye solar cell (DSC) materials and technology. PNA is part of the NSG Group (NSG). Initially the collaboration will address the non-view glass market (spandrel) which accounts for 40% of the total glass market. The global market for flat glass is estimated to be 6 billion square metres in 2010 and growing at 5% a year. The two compa- nies have signed a Memorandum of Understanding (MOU) to form a Joint Venture (JV) which will be located in the USA. Furthermore, the joint venture will develop and deliver a total platform solution to downstream suppliers to the building and construc- tion markets seeking to develop glass-based BIPV products.
Furthermore: • Dyesol closed the third quarter of FY 2010 with $4.53M cash at bank, reduced creditors and no debt. • Dyesol and Singapore Aerospace Manufactu- ring Pte Ltd (SAM) have signed a Memorandum of Understanding to collaboratively design, develop and build an automated pilot manufacturing facility for DSC products. • Dyesol reduced the price of Z907 to reflect the economies of scale achieved through the scale up of Dye production.
vergreen Solar, Inc. (NASDAQ: ESLR) announced the pricing of its offering of $165 million aggre-
gate principal amount of its 13% Convertible Secured Senior Notes due 2015 to qualified institutional buyers pursuant to Rule 144A promulgated under the Securities Act of 1933, as amended (the “Securi- ties Act”). The offering is expected to close on April
26, 2010, subject to satisfaction of customary closing conditions. Evergreen Solar will use the net proceeds from this offering for the purchase of $124.5 million aggregate principal amount of its 4% Convertible Se- nior Notes due 2013 concurrent with the closing of this offering, and intends to use the remainder of the net proceeds for general corporate purposes, working capital and capital expenditures for further expansion of its manufacturing facility in Wuhan, China.
V Group (EVG), a leading supplier of wafer bonding and lithography equipment for the
MEMS, nanotechnology and semiconductor markets, announced that Morocco-based wafer-level camera manufacturer Nemotek Technologie has placed a repeat order for EVG’s bonding and UV nanoimprint lithography (UV-NIL) systems – the EVG520IS and IQ Aligner. Nemotek will use these systems to address its production demands for CMOS image sensors and waferlevel optics that will be deployed in wafer-level cameras for mobile applications. This order marks a significant win for EVG as it paves the way for a long- term partnership with Nemotek—and further bolsters EVG’s dominant position as the preferred bonding and UV-NIL equipment provider for waferlevel ca- mera applications.
Furthermore, EVG has shipped two wafer bonding systems to the University of Michigan‘s Lurie Nanofa- brication Facility (LNF) in USA.
http://www.nemotektechnologies.com http://www.evgroup.com http://www.mnf.umich.edu/MNF