Feature: Sustainable electronics
Figure 4: Integration of active and passive electronic components, sensors, heaters, anteannas and communication harnesses on one ReUSE-bonded foil
The front shield market is now developing apace. It is estimated that its compound annual growth rate is above 7%, with the current market valued at over $15bn per year. The integration of electronics is set to increase this value signifi cantly
in production, but the inability to reuse at the end-of-life or recycle in any impactful way are not well considered. So, as the industry moves from LCA comparators to full circularity assessments, this will be its weak point.
Figure 5: OMSE, ReUSE bonded, sealed and unzippable integration of moulded plastic and Flexi-Hibrid electronics
Fully-recyclable integrated-electronics solution In2tec is a sustainable electronics design, development and manufacturing company with sustainable answers to the current problems. Its patented ReUSE technology provides the foundation for a fully-recyclable integrated-electronics front shield; see Figures 1-6. ReUSE delivers fully ‘unzippable’ bonded conductive traces,
printed sensors and electronic and mechanical components on a sustainable substrate, such as PET, bioplastics, or nano- polymers. These systems are referred to as Flexi-Hibrid Electronic (FHE) technologies. Using ReUSE bonding materials, the flexible circuit
Figure 6: Flexi-Hibrid circuit assembly showing components in fi rst-life application within automotive shield, easily transitioned into a second- life application
itself effectively to the integration of multiple electronic components, since they are subjected to high temperatures and pressures during moulding. More significant is the lack of end-of-life recyclability of
this solution: As the unit becomes a thermo-set synergy of parts, it becomes nearly useless for second use. The level of recyclability is even lower than the current technology of separate fibreglass resin printed circuit boards, wiring and connectors. In some LCA calculations, there’s a significant offset toward the apparent lower part count and reduced logistics
38 October 2023
www.electronicsworld.co.uk
board can be formed and laminated to a pre-vac-formed or injection-moulded one-piece front shield. The rear of the front shield moulding incorporates cavities to house the components of the Flexi-Hibrid sub-assembly, fully protecting the electronic components and sensors whilst, crucially, allowing full end-of-life disassembly and recyclability. The harness or connecting system is also created using
an additive process to the FHE substrate, for a seamless and fully-integrated interconnection system, significantly minimising use of connectors. The In2tec solution called “On-Mould Sustainable
Electronics”, or “OMSE”, offers all the benefits of in- mould electronics, whilst delivering the ultimate ability to completely disassemble the unit into its constituent parts at its end of life. The unzipping process, called “ReCYCLE”, is delivered at extremely low energy levels, using just hot water. This allows the electronic components to remain undamaged in separation, ready for second-life use; see Figure 6. We believe that OMSE is very likely the first truly fully-recyclable solution on the market today.
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