Feature: PCBs
related issues are oſten cited as one of the most common causes of electronic product failure. Tis is because electronic components generate heat during operation, and if they are not adequately cooled or ventilated, the heat can cause them to fail or even permanently damage the product. Additionally, high ambient temperatures or excessive power consumption can contribute to heat- related failures. Terefore, it’s important for electronic products to be designed with appropriate cooling and ventilation systems to prevent heat buildup and ensure reliable operation.” Of course, as a promoter of a solderless
assembly technology, I had hoped that solder would have been on top of the list. Nevertheless, the answer was somewhat satisfying since the Occam Process was designed to afford inherent and integral thermal management. An aluminium (or other) metal substrate (component board) greatly improves heat dissipation. So, in that respect Chat got it right. Trying to refine things a bit more I
then asked:
Q: What is the number one cause of failure in PCB assemblies? A: “Te number one cause of failure in PCB assemblies can vary depending on the specific design, components used and usage environment. However, one of the most common causes of failure in PCB assemblies are soldering issues. Poor soldering can cause electrical connections to be weak, intermittent or disconnected, leading to circuit failures.” And there it is! Most in the industry
know that soldering issues cause many problems – and Chat picked up on it. But, just like Chat, the industry stops there: “Te problem is the soldering system.”
Nope! “It’s testing/inspection…”
Nope, nope, nope! Te root cause of the problem is right
in front of us. I love this quote by English writer and philosopher G.K. Chesterton: “It isn’t that they can’t see the solution; it is that they can’t see the problem.” Instead of solving the problem, the industry has created layers of
34 October 2023
www.electronicsworld.co.uk
Chat GPT mostly regurgitates what’s already out there. But, in the not-too- distant future, AI systems will start providing proper solutions
workarounds to manage solder’s limitations. As a result, the real problem is invisible, even to ChatGPT. It’s not the soldering system, it’s the
solder itself. In Chat’s defence, it isn’t thinking by itself but, rather, collating what it finds online, as supplied by industry over the years. Now, at least, by assigning blame to the
“soldering system”, we are moving in the right direction. Let’s see if we can get Chat to identify the underlying cause:
Q: What is the most commonly- identified point of failure in component assembly? A: “Te most commonly-identified point of failure in a component assembly is the solder joint. Solder joints are the connections between the components and the PCB. Tey are made by melting solder and then flowing it over the joint. If the solder joint is not made properly, it can be weak and can break under stress.” Now we’re getting somewhere. I then asked:
Q: How can failures in PCB assemblies be prevented? A: “Failures in PCB assemblies can be prevented by following good design, manufacturing and testing practices. Here are some steps that can help prevent failures in PCB assemblies: 1. Good design practices: PCB design should be optimised for reliability and performance, with careful
consideration of factors such as trace routing, component placement, grounding and thermal management. Te design should also be validated through simulations and prototypes to ensure that it meets the required specifications.
2. High-quality components: High-quality components should be used for PCB assembly, with careful consideration of their specifications, ratings and reliability. Components should be purchased from reputable suppliers and tested to ensure that they meet the required standards.
3. Proper assembly techniques: PCB assembly should be done using proper techniques, such as using appropriate soldering materials, ensuring proper component alignment, and following recommended soldering procedures. Assembly should be done in a controlled environment with proper electrostatic discharge protection and cleanliness.
4. Rigorous testing and inspection: PCB assemblies should be tested and inspected thoroughly, to detect and correct any potential defects or issues. Tis can include functional testing, electrical testing and visual inspection, to ensure that all components are properly soldered and there are no shorts, open circuits or other defects.” I get it. Work really hard to ensure that
this very limiting and flawed system for component assembly can continue to be the go-to methodology into the future. Oh, and inspect and test and test. Yes, change is hard, even for AI. Tis is a
disappointing answer. As we see with today’s AI, and
specifically with ChatGPT, they mostly regurgitate what’s already out there. Te day will come in the not-too-distant future when these systems will actually stop reiterating the obvious and start providing proper solutions. Instead of trying to make a flawed system work, it will – I hope! – identify the real problems and then provide appropriate solutions. Here, in this case, it’s not the soldering
system, it’s the solder. Solder is the weakest link. Solder is the problem – the root cause of most failures in electronics production.
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