Feature: Interconnections
Optimised manufacturing processes
for metal lead frames By Jochen Kern, Head of Sales and Marketing, Micrometal Etching Group
M
initurisation and weight reduction are increasingly becoming the ruling criteria in the design of
modern-day electronics, regardless of the application or sector these devices are destined for. This means that component suppliers must be carefully selected, to meet these criteria and ensure optimised outcomes. Lead frames are used in
semiconductor device assembly; essentially, they are thin layers of metal that connect the wiring from tiny electrical terminals on the semiconductor surface to the large- scale circuitry on electrical devices and
32 May 2023
www.electronicsworld.co.uk
Miniturisation and weight reduction are increasingly becoming the ruling criteria in the design of modern- day electronics, regardless of the application or sector these devices are destined for
circuit boards. Due to their small scales and intricacies of the application they must meet, it is extremely important to choose the right process for the lead frames’ cost-effective and accurate manufacture. And as anyone in the business knows, very often they have customised specifications and features, which include specific electrical and thermal properties and cycle times – so not all lead frame sizes fit all applications.
Specialist manufacturing process Contrary to appearances, lead frames can be extremely complex and are very fragile. Indeed, in many instances, geometric complexity and the requirement for exacting tolerances
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