Feature: Aerospace
To meet these requirements, Parker
Chomerics now offers its CHOFORM 5575 Form-in-Place (FIP) EMI gasket. This robotically-dispensed material can be directly applied onto the aluminum casting of the drone to act as an EMI barrier, blocking crosstalk that can lead to any number of malfunctions. Using an FIP gasket saves up to 60% of space and weight inside the drone housing, as flanges can be as narrow as 0.025in (0.76mm). CHOFORM 5575 is a moisture- cured silver-plated aluminum-filled
silicone material, offering shielding effectiveness of up to 80dB. It also has high resistance to corrosion when dispensed onto aluminum, preventing galvanic corrosion inside the electronic enclosure.
Reducing thermal eff ects in drones To mitigate thermal eff ects, Parker Chomerics has developed THERM-A- GAP GEL 37, with thermal conductivity of 3.7W/m-K. T e gel conducts heat away from the chipset and to the drone’s enclosure.
This pre-cured single-component
gel can be dispensed directly onto the chipset by automation, significantly reducing production time. THERM-A-GAP GEL 37 has a soft
paste consistency, eliminating any stress and weight on the electronic components; it also requires no mixing or curing. Ultimately, adding both EMI
shielding and a thermal solution to a drone through automated methods improves productivity and reduces time to market.
Parker Chomerics CHO GEL37 dispensing
Parker Chomerics THERM-A- GAP GEL 37 has a soft paste consistency
Parker Chomerics CHOFORM 5575 Form-in-Place EMI gasket
www.electronicsworld.co.uk May 2023 25
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