Technology
Airbus and STMicroelectronics collaborate on power electronics for aircraft electrification
Airbus and STMicroelectronics have teamed up to develop more efficient and lighter power electronics for hybrid and fully- electric aircraſt. Te cooperation will focus on developing silicon carbide (SiC) and gallium nitride (GaN) devices, packages and modules adapted to Airbus specifications. Te partners will assess these components by conducting advanced research and tests on demonstrators, such as e-motor control units, high- and low-voltage power converters and wireless power transfer systems. “Tis collaboration with STMicro-
electronics will be key to supporting Airbus’s electrification roadmap. Leveraging its expertise and experience in power electronics for automotive and industrial applications with our own record in aircraſt and VTOL electrification will help us accelerate the development of the disruptive technologies
required for the ZEROe roadmap and CityAirbus NextGen,” said Sabine Klauke, Airbus Chief Technical Officer. SiC and GaN belong to the family of
wide-bandgap semiconductors, which have superior electrical properties compared with traditional semiconductor materials like silicon. Tey also allow the development of smaller, lighter and more-efficient high- performance electronic devices and systems, particularly in applications requiring high- power, high-frequency or high-temperature operations. “We are at the cutting edge of the
development of innovative power semiconductors with higher-efficiency products and solutions based on advanced materials, such as silicon carbide and gallium nitride,” said Jerome Roux, President of sales and marketing at STMicroelectronics.
“Aerospace is a highly demanding market with specific requirements. Cooperating with Airbus, a global leader in this industry, gives us the opportunity to define together new power technologies the industry needs to realise its decarbonisation goals.” Decarbonising flight requires a range of
solutions based on a mix of new fuel types and novel technologies. One such solution, hybrid-electric propulsion, can improve the energy efficiency of every aircraſt class and reduce aircraſt CO2
emissions by up
to 5%. Tat figure could be as high as 10% for helicopters, which are generally lighter than fixed-wing aircraſt. Future hybrid and full-electric aircraſt require megawatts of power to operate. Tis will require huge improvements in power electronics in terms of integration, performance, efficiency, and component size and weight.
Tresky works on low-voltage drive module with multifunctional high-current circuit carrier
Tresky and the Kiel University of Applied Sciences, Germany, are developing high- performance power modules for sustainable energy generation and electromobility. Teir program is part of the ProMuPower project, which focuses on the development of a new type of circuit carrier, including a flexible manufacturing process. Te new innovative assembly and connection
technology enables large-area, heat-resistant, low-inductance and temperature-conductive connections of electronic power modules for e-drives. Te 48V demonstrator developed in the project shows these advantages very clearly. Its field of application is mainly mild hybrid drives in road vehicles, but also drives for industrial trucks and servo drives. In addition to the main component, if required, customers will be given access to the entire production flow consisting of joining material, component positioning, process specification and validation methods. Power electronic modules are key
components for generation, distribution and energy application and play a significant role in electromobility. Te service life and energy
efficiency of these modules significantly determine the efficiency and economic success of the module. State-of-the-art assembly and connection technology will help solve today’s problems in the production and application of power electronic assemblies. However, it is precisely this assembly and
connection technology that is difficult to implement, both for SMEs and large companies that are new to manufacturing, because considerable resources must be invested in process development. In the ProMuPower project, a special pick-
and-place component positioning is created in the form of an innovative production technology, an organic joining material (TIM film) and a joining method (lamination). Tis helps create multifunctional power substrates with thick copper conductor layers and integrated temperature and current sensors. Te very effective thermal interface film (TIM film) is electrically isolating and allows thick copper assemblies without thermomechanical stress in the layers. Te more robust construction of the new power modules ensures long-lasting
The
ProMuPower device by the Kiel University of Applied Sciences and Tresky
and energy-efficient products. Tis enables a lot more economical production and an increased lifetime and power density of power modules compared to production with ceramic circuit carriers. Te novel process is environmentally
friendly, as the circuit carriers are produced by means of special individual assembly and the required conductor track layout is created by stringing together copper function plates, some of which are already equipped with sintered (semiconductor) components. Tese thick copper conductor plates are created by stamping or laser separation without requiring any chemical processing steps.
www.electronicsworld.co.uk July/August 2023 05
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