Contents


Regulars 04 Trend


Cover Story By Rochester Electronics


08 Technology


46 SPE 6-part series - Article 2: What are the Single Pair Ethernet standards? By Ruud Van Den Brink, product manager industrial communications and Manuel Ruter, senior principal engineer


48 Products 49 Buyer’s guide 50 Supplier’s guide 51 Web locator


Cover story by Rochester Electronics, More on pages 6-7 Features SENSOR TECHNOLOGY


13 Kyocera’s AI-based high-resolution depth sensor for close imaging sets new records By The Kyocera group


14 Autonomous vehicles: A fast-growing market that depends on inertial motion sensor technology


By Meindert Zeeuw, Director of the Automation & Mobility Business Line, Movella


16 Reaching for a better drip with robots By Ross Turnball, Director of Business Development and Product Engineering, Swindon Silicon Systems


18 Transitioning from manual to digital calibration By Rebecca Bentley, Senior Technical Sales Executive, Mantracourt


POWER


20 What is the meaning of the IP ratings for power supplies?


By Maximilian Hülsebusch, Global Product Marketing & Communications Manager, PULS Power


22 How to provide eff ective power management for AI datacentres By Kenton Wiliston, Digikey


25 Microgrids and private networks, think ‘The Good Life’ but for power By Alex Howison, Development Director, Eclipse Power Optimise


26 A sustainable approach to the challenge of rising global energy demand By Yannick Sel, Commercial Director of Projects, Sarens


DISPLAY


30 Display controllers: The key to seamless user interactions


By Deboleena Dutta, Junior Content Writer, Research Nester


MEMORY


32 Reducing the performance gap between DRAM and AI processors By Allen Youssefi , Director of Product Management, Memory and Interface and Extended Enterprise Products, Renesas


RF DESIGN


33 7layers and Rohde & Schwarz present pioneering Bluetooth RF test solution to validate Bluetooth channel sounding By Rhode & Schwarz, 7layers


34 How to achieve ultrafast power supply transient response for RF applications


By Xinyu Liang, Applications Engineering, Analog Devices


38 Designing for the future – Exploring the challenges and possibilities of designing to 300 GHz By Tudor Williams, Director of Technology, Filtronic


42 Radio access (RAN) networks - now and future By Phil Evans, Business Development Director - Connectivity, TÜV SÜD


EDITOR: Casey Porter Tel: +44 (0)1622 699107 Email: cporter@datateam.co.uk


SALES: Kalil Kayani Tel: +44(0)7557 514154 Email: kkayani@datateam.co.uk


PRODUCTION/DESIGN: Tania King Email: tking@datateam.co.uk


MEDIA DIRECTOR: Colin Wilkinson Emai: cwilkinson@datateam.co.uk


ISSN: 1365-4675 PRINTER: Buxton Press Ltd


SUBSCRIPTIONS: Subscription rates: 1 year digital only - £40


1 year print & digital (UK only) - £75 1 year print & digital (Overseas) - £180 Email: datateam@c-cms.com www.electronicsworld.co.uk/subscribe


15A London Rd, Maidstone ME16 8LY, United Kingdom


Follow us on Twitter


@electrowo


Join us on LinkedIn


www.electronicsworld.co.uk


February 2025 Volume 130 Issue 2043 £5.90


IN THIS ISSUE: • Sensor Technology • Power • Display • Memory • RF Design


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54