Contents Regulars


04 Technology 08 Focus: FeRAM 10 Column: Embedded design by Myk Dormer


12 Column: Silicon systems design by Alpinum


Features


16 The engineering of switch miniaturisation By Liu Junxiong, R&D engineer, Swiclick


20 Adapting LPDDR memory technology for AI workloads By John Eble, VP of Product Marketing, Memory Interface Chips, Rambus


22 Interoperability testing challenges in open optical networks By Tomohide Yamazaki, Assistant Manager, Anritsu


26 UVC LEDs on course to displace mercury vapour lamps By Gary Kardys, Head of Marketing, Marktech Optoelectronics


34 A new approach to windshield defrosting in EVs By Derrick Redding, CEO, Betterfrost Technologies


36 The hidden manufacturing challenge behind AI cooling


By Ben Kitson, Head of Business Development, Precision Micro


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42 Suppliers’ guide /Web locators


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40 Extending range and reliability for IoT data streams By Rolf Horn, Applications Engineer, DigiKey


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30 The foundation of electronics reliability By Scott Horton, VP of Marketing, Johanson Technology


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www.electronicsworld.co.uk September 2026 03


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September 2026 Volume 131 Issue 2059 £5.90


IN THIS ISSUE: • Power management • Thermal management • Wireless design • Optoelectronics and LEDs • Switches


Regular columns: • Technology • Focus: FeRAM • Embedded design • Silicon systems design


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