Power
Design a reliable and agile power semiconductor assembly
Paul Bentley, managing director of GD Rectifiers, talks to CIE Magazine about the power assembly design and manufacturing process and how to partner with a suitable supplier
I
n addition to distributing standard semiconductor components from world-leading manufacturers such as IXYS, Semikron and EDI, GD Rectifiers has developed a full range of power semiconductor assemblies designed and tailored to customer specifications. Power assembly design can often be a critical factor in developing the next generation of products and applications. Ensuring your assembly designer provides specialist technical support from enquiry right the way through to delivery is crucial.
Choosing the right partner It’s important to partner with an established manufacturer whose team of engineers have been designing and manufacturing power assemblies for many years. Enhanced industry experience will see the company offer specific power solutions by adapting existing configurations or designing custom builds using state-of-the-art semiconductors such as diodes, thyristors and IGBTs. Experienced manufacturers will be able to offer customised solutions and draw on previous knowledge and historical projects, providing a suitable solution for your build.
Taking a holistic approach is vital: ensuring the manufacturer has access to a wide range of semiconductors, controllers and accessories for any refurbishment or repair work required is key. If customers wish to supply their own components, ensuring the manufacturer is happy to build with customer-specific components outside of their general stock list is essential. Explore the manufacturer's full assembly range and identify any potential designs or configurations that might be of interest in future. Future-proofing your supplier base and assembly portfolio will prove helpful and timesaving as new projects evolve. Choose a designer and manufacturer with an extensive power assembly product portfolio, including diode, thyristor and IGBT assemblies; discrete device and isolated module assemblies, single- phase, three-phase and hex-phase assemblies, rotating diode assemblies, photovoltaic triple diode assemblies, rectifiers, regulators, and power assembly controllers and accessories.
68 September 2023
electromechanical integrity of components during operation, used for diodes, thyristors, GTOs and IGBT devices.
Designers work with customers closely on creating prototypes with a strong focus on maximising semiconductor performance within an assembly. Typically, engineers will assess; type of heatsink, transient conditions, overloads, and ambient temperature, finishing and the cooling method before a large production run. The designer will propose an assembly design in CAD software considered to meet your requirements. After design discussions, the designer will then progress forward to prototyping. At this point, it’s crucial for the designer to have a broad range of semiconductor devices in stock, ready to deliver a fast turnaround but most importantly
From design to reality From the initial enquiry the designer will work with customers to spec out the assembly, ensuring they collate all the information required to offer a suitable solution. Discussions will be held around the assembly type, whether discrete or module semiconductors are required, understanding the circuit, and identifying if it’s a bridge, AC control or star rectifier circuit. Designers will then explore the input and operating current voltage, DC current, ambient/ water inlet temperature and cooling conditions. At this stage both parties will discuss the maximum mechanical outlines and if there’s any size constraints and any associated auxiliary components required in addition to the assembly, such as fuses or thermal trips. Power assembly components such as device clamps, heatsinks and accessories such as firing board, trigger circuits will be considered for maintaining the thermal and
Components in Electronics
www.cieonline.co.uk.uk
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80
