Advertorials Portable AWG allows signal-generation for up to 16 channels


Spectrum Instrumentation’s latest line of Arbitrary Waveform Generators (AWGs) is based on the LXI instrumentation standard and has been created for engineers and scientists that need to simultaneously generate up to 16 precise electronic signals. Small and compact, the units are ideal in automated testing or remote- control type applications. With six new instruments being released, users are offered a wide choice of configurations and performance levels. All the units feature the latest 16 bit digital-to-analog converter (DAC) technology and combine this with low-noise flexible outputs; allowing them to generate almost any test signal in the DC to 60 MHz frequency range. Furthermore, full remote control is achieved through a simple Ethernet connection to any PC or local area network (LAN) making them easy to integrate into virtually every test system.


The new DN2.65x series of generatorNETBOX instruments are available with 4, 8 or 16 fully synchronous channels and offer output rates of 40 MS/s or 125 MS/s. Signals with a programmable output swing of up to ±6 V into high impedance or ±3 V into 50  can be generated. The units also include large on-board memories of up to 2 x 512 MSamples that can be utilized in a number of different operating modes to allow the generation of long and complex waveforms. This includes Single-Shot, Loop, FIFO, Gated and Sequence Replay modes. Signals can even be generated while new waveform data is being loaded to the on-board memory.


The AWG offers front-panel multi-purpose I/O connectors that allow access to synchronous digital (marker) outputs, trigger output, run and arm status, the PLL


ATC Semitec’s successful multi-purpose IP67


temperature sensor ATC Semitec’s AT-11 temperature sensor, offers the best accuracy/cost/quality ratio available in the industry. Highly versatile, they are widely used by many industries worldwide, across a wide range of diverse applications including battery management systems within e-vehicles, HVAC, air conditioning, and digital thermostats.


Using the popular Semitec 103AT-2 precision NTC thermistor, this TPE encapsulated thermistor sensor offers accurate temperature control (with an accuracy of +/-0.3°C at 25°C) and monitoring from -50°C to +110°C. The sensing tip at just 5mm x 6mm x 15mm long ensures a fast response to thermal change. Its accuracy has led to the Semitec 103AT-11 becoming virtually an industry standard sensor within the electronic digital thermostat sector.


During the moulding process, the AT-11’s sensing tip is sealed to the single- insulated TPE leads to ensure IP67 integrity and therefore can be used where moisture ingress is often a problem to epoxy sealed sensors.


These top features have recently made it the thermistor of choice within battery management systems of e-vehicles with leading automotive manufacturers.


Other popular applications include underfloor heating, heat pumps, HVAC including air-conditioning, solar and frost-protection. The AT-11 sensor also boasts a 3.75kVAC di-electric strength.


ATC Semitec not only stock the standard 103AT-11 at 600mm long but also longer 1.5m and 3m long variants. For volume applications, any length from 100mm to 10m long is available as well as integral connector options.


The Semitec AT-11 can also be fitted with any NTC from the AT-2 series which means R25 values from 1kohm to 100kohms are available. Furthermore the higher accuracy 0.5% tolerance AP-2 series NTC thermistors can now be incorporated meaning that the “AP-11” temperature sensors can provide +/-0.5°C interchangeability from - 60°C to +70°C.


Want to try before you buy? Call our technical sales team today on 01606 871680 to discuss the AT-11 sensor, what it can do for your control system and request some samples.


www.atcsemitec.co.uk German Component Distribution records weak


order situation Turnover of German Component Distribution (according FBDi association) decreased by 2% in 2nd quarter 2019. Order situation remains poor.


For the first time after two years the decreasing order situation in the German component distribution results in a slight drop in turnover. Sales of distribution companies under the umbrella of the Fachverband Bauelemente-Distribution (FBDi e.V.) dropped by 2% to 879 Million Euro. Orders further weakened to around 748 Million Euro, equating to a book-to-bill ratio of 0.85.


(Comment from FBDi: the overall statistics for 2018 and 2019 were adjusted for the figures of members that no longer participate in the statistics.)


Regarding the major product segments, semiconductors and passive components remained at the previous year's level (623


Million Euro or 112 Million Euro), electromechanics dropped by 12% to 91 Million Euro, power supplies dropped by 7% to 26 Million Euro. The smaller product segments (displays, assemblies and devices) also declined, only sensors grew by 22%. The market share has scarcely changed: semiconductors held a 70% share, passive components 13%, electromechanics 11%, all other segments combined to 6%.


The general uncertainty caused by Brexit, controversy in customs and other macroeconomic distortions will remain, according to Steinberger: “If we are very realistic and we add hard realities – like climate change, end of throwaway society - to the political confusion, this leads us to mixed prospects for the short-term market development. On a long term, I am convinced that only sustainable technology and innovation can contribute to a macrosocial solution. This is a big challenge, but offers huge potential for our industry.”


reference clock or asynchronous I/O lines. Weighing as little as 6.3 kg, the generatorNETBOX products are easily portable and can work almost anywhere: freestanding on a test bench, rack mounted with other equipment or even mobile (when powered by the optional 12 or 24 V DC sources).


www.spectrum-instrumentation.com Alliance Memory supports customers with Micron


EOL single- and dual-die 8G DDR3L SDRAMs When Micron Technology, Inc. announced a last-time buy date of January 13, 2019 for some of its most popular 8G DDR3L single-die SDRAMs, Alliance Memory had its customers covered. In keeping with its commitment to supporting their legacy SDRAM needs, the company responded by offering the original Micron part numbers, along with Alliance Memory identical replacements of the monolithic


devices, which are available from stock in the company’s California warehouse.


Now Alliance Memory announces the immediate availability of dual-die package 8G DDR3L SDRAMs for long-term support and new designs. The parts are available in mass production with lead times of just four to six weeks.


To learn more about Alliance Memory’s offering of Micron 8G DDR3L SDRAMs, please visit:


www.alliancememory.com/micron8G Helping ensure astronaut safety


Smiths Interconnect products perform well during NASA’s successful Orion test flight In the year that the world celebrates the 50th anniversary of Apollo 11 taking man to the moon, Smiths Interconnect have their own space-related achievement to celebrate.


Smiths Interconnect’s high-speed D-sub connectors and harnesses were part of NASA’s successful Orion test flight to conduct a full-stress test of the Launch Abort System (LAS). The test proved that Orion could pull astronauts to safety in the event of an emergency during launch.


The Orion LAS, with a mock-up Orion capsule, launched on a modified Peacekeeper missile from Cape Canaveral Air Force Station in Florida to an altitude of about 6 miles. Travelling at nearly 1,000 miles per hour, the LAS pulled the crew module away from its booster and oriented it for splashdown in the Atlantic Ocean.


The Smiths Interconnect connectors are the backbone of the data and controls network on Orion and must withstand the extreme levels of mechanical shock and vibration produced by the LAS. Test data from 890 sensors was sent in real-time to ground sites, as well as recorded by 12 on-board data recorders. The success of this test flight is a major achievement for our product.


The Orion LAS offers the highest thrust and acceleration escape system ever developed and is the only system of its kind in the world.


Smiths Interconnect’’s Chief Technologist Richard Johannes said: “Our Orion connectors and harnesses have been developed through close collaboration with Lockheed Martin Space Systems and NASA. They not only meet mechanical shock and vibration levels several times higher than today’s extreme environment interconnects but do so without losing any high speed data transfer capability. Our participation in the LAS programme and the success of our high data rate interconnect design and testing has confirmed Smiths Interconnect as a global leader in this area.”


www.smithsinterconnect.com


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