Advertorials Socket your BGA’s with Selwyn Electronics…


Advanced Interconnections low stack height Mezza-pede®


SMT Connector


Advanced Interconnections’ newest Mezza-pede®


SMT Connector, low


profile model DHAL, reduces board stack height by 15%. When paired with the mating socket, a z-axis stack height of 0.132 in. (3.4mm) is achievable – providing a reduction in package height and a shorter signal path in datacom and networking applications.


Advanced Interconnections Corporation USA Tel: 1 (401) 823-5200 Email: info@advanced.com www.advanced.com


Problem solved: Discontinued passives and


long lead times with current components To help engineers and buyers in the Electronic Components Industry with End-of-Life (EoL) issues and today’s long lead times for current products, BEC Distribution has announced the availability of direct alternatives to TOKO/Murata, Coilcraft, Vishay and Sumida lines, with short lead times of 6-8 weeks, where most manufacturers are currently working on 16-30 weeks.


BEC’s range of EoL replacements and pin-for-pin replacements for current passives includes: shielded power inductors, multi-layer ceramic chip inductors, radial peaking coils, open wire-wound chip inductors and thin-film chip inductors.


Typically, large component manufacturers discontinue product lines after 5-10 years. This can have a potentially disastrous impact on customers whose products have longer expected lifetime eg Aerospace, Medical, Surveillance or Defence industry equipment. The availability of BEC’s component replacements will far exceed 10 years.


BEC Distribution’s EoL component supplies will be a lifeline to R&D engineers and buyers, where components have been designed into their product lines. With a stock of 15m passive components and franchised distribution agreements with quality alternative component manufacturers, BEC can provide high quality, pin-for-pin direct replacement or alternatives. If the required components are not in stock, then BEC will track down and source matching alternatives, ensuring that EoL issues will not hinder customers’ projects.


With support from BEC, engineers and buyers alike can plan ahead right from the beginning when components are first used or when they are designed-in, ensuring that EoL does not necessarily mean end of supply or support.


BEC Distribution offers drop-in alternates for most manufacturers including Toko, Sumida, Murata, TDK, Coilcraft, Cooper, Bourns, Vishay, Wurth… etc.


For stock availability, pricing or free samples please contact BEC's sales office: Tel: 0845 4900 405 or email sales@bec.co.uk


Smiths Interconnect at DSEI 2019,


stand #S3-520 An extensive portfolio of solutions to be exhibited for Radar, Communications, ISR and Electronic Warfare


Smiths Interconnect, a division of Smiths Group plc, will be exhibiting at DSEI 2019 in London on September 10th–13th on stand #S3-520.


A range of technically differentiated connectivity solutions from its technology brands EMC Technology, Hypertac, IDI, Lorch, Millitech, RF Labs, Sabritec, TECOM, and Trak will be on display, including antennas and tracking systems, RF components, connectors and cable assemblies for defence market applications.


Defence connectivity products on display will include high power circular and rugged high-density interconnects, waveguide components, low-loss 50GHz cable assemblies, attenuators, millimetre wave components as amplifiers and multipliers, 325GHz antenna and networking capabilities.


A range of the high reliability connectivity products to be exhibited by Smiths Interconnect at the DSEi 2019 exhibition in London


“Smiths Interconnect solutions enhance mission-critical communication systems for Communications, Electronic Warfare, ISR and Radar applications through superior connectivity”, says Paul Harris, VP of Sales and Marketing. “Our technically differentiated solutions provide customers with a competitive advantage when tackling the challenges of higher power, higher data rates, wider bandwidth, and greater connectivity - all within a smaller footprint.”


To learn more, visit us at DSEI 2019, stand #S3-520, or go to www.smithsinterconnect.com


The Interconnection Specialists, Selwyn Electronics are pleased to offer an extensive range of Ball Grid Array (BGA) socket and adaptor systems.


From 1.27mm down to 0.3mm pitch versions and solutions for terminating BGA, LGA, QFN, LCC and QFP devices, Selwyn can offer an economical method of device validation and development where soldering the device to the PCB is not practical.


Alongside the low insertion force socketing systems, is range of adaptors onto which the device can be soldered and then loaded into a socket or pinned out to a custom footprint, this also subjects the device to a lower thermal stress level than soldering direct to a PCB.


If you can provide the details of your device, we can provide a socket/adaptor solution for you.


Tel: 01732 765100


Email: interconnect@selwyn.co.uk www.selwyn.co.uk


Northern Manufacturing & Electronics


Northern Manufacturing & Electronics, the North’s top industrial technology show, returns to EventCity, Manchester on October 2nd and 3rd 2019. If you’re involved in electronics, engineering or manufacturing, this is one show not to miss. The free-to-attend event delivers an impressive selection of top vendors covering production, test, consumables and a full range of subcontract services from PCB production to full CEMS solutions. There is a huge range of components on show, both


electronic and mechanical, including custom-made plastic parts, enclosures, connectors and sub-assemblies such as power supplies and ruggedised data storage devices. There’s also live demonstrations of the latest production technologies, including machining centres, 3D printing, laser and EDM machines; Production equipment highlighted includes everything from ERP software, stock management systems, storage, labelling and much more. There’s also business support services and a great free seminar programme too. Find out more and book your free tickets at:


www.industrynorth.co.uk Tough miniature trigger switch launched by Omron


A new miniature trigger switch for heavy duty control applications including industrial and domestic power tools has been introduced by Omron Electronic Components Europe. Its innovative design delivers exceptional dust, shock and vibration resistance within a very small overall size.


Ideal for all types of brushless DC applications including industrial equipment as well as cordless DC power and gardening tools, the new Omron C3AW is a highly durable and compact solution. Rated at 10mA, 42VDC, the C3AW achieves dust resistance to IEC IP6x through with a sealed


rubber cover over the moving parts and an ultrasonic welded connection between the cover cases. It can withstand shocks of up to 3000 m/s2 and vibration of up to 200 m/s2 experiencing no more than 100µs of chattering at the maximum rated shock level.


Commenting, Andries de Bruin, Senior European Product Marketing Manager at Omron said, “Omron is leading the way with a control switch that meets the needs of the new generation of brushless DC power tools enabling small overall size, protection against demanding environments and a high power output while withstanding vibration. The C3AW is one of the smallest solutions on the market offering this level of environmental protection.” He continued, “Omron manufactures this new switch using a fully automatic assembly process, guaranteeing the highest quality of production.”


With an overall size of just 25mm wide by 13.5mm deep by 28.5mm high, the C3AW is rated for at least 300,000 operations. It can be used at temperatures between -20 and +65ºC.


http://components.omron.eu


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