Test and Measurement
Failure analysis and reliability testing: Why SAM is now considered essential equipment
Scanning Acoustic Microscopy (SAM) has become integral testing equipment in semiconductor supply chain integrity, inline manufacturing, R&D, quality control labs, and even for 100 per cent inspection of all manufactured materials, according to OKOS
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n manufacturer test labs, R&D centres, material research groups, and quality control departments, the search for minute defects is spurring investment in Scanning Acoustic Microscopy (SAM) equipment. The failure analysis and reliability detection metrology technology has become essential and is now taking its place alongside other lab testing and measurement instrumentation like X-ray and scanning electron microscopes (SEM). In current market conditions with electronics supply chain extremely constrained, SAM is a highly effective tool to help mitigate proliferation of counterfeit components in semiconductor supply chain. SAM, also known as Ultrasonic Non- Destructive Testing (NDT), is utilized in industry to identify small defects in products or components during manufacturing and to analyze the specific root cause of a failure when a device fails in the field. The demand for this kind of robust failure detection capability is increasing the technology’s use among manufacturers of consumer, industrial, and military electronic devices.
SAM offers powerful non-invasive, non- destructive imaging and materials analysis for inspecting the internal structures of opaque materials. Depth-specific information can be extracted and applied to create two-and three-dimensional images without time-consuming tomographic scan procedures or costly X-ray equipment. Specialists can analyze SAM images to detect and characterize device flaws such as cracks, delamination, inclusions and voids in bonding interfaces as well as evaluate soldering and other interface connections on PCBs. Recent advances in SAM facilitate the
48 October 2022
Scanning Acoustic Microscopy (SAM) has become integral testing equipment in inline manufacturing, R&D, and quality control labs.
detection of much smaller defects than previously possible.
“Advanced, phased array SAM systems make it possible to move to a higher level of failure analysis because of the level of detection and precision involved. In the past, detecting a 500-micron defect was the goal; now it is a 50-micron
Components in Electronics
defect. With this type of testing, we can inspect materials and discover flaws that were previously undetected,” said Hari Polu, President of OKOS, a US- based manufacturer of industrial SAM ultrasonic non-destructive testing systems. The company serves the electronics manufacturing, aerospace, and metal/alloy/
composite manufacturers, and end-user markets.
When manufacturers take advantage of the higher level of failure detection and analysis, the production yield and overall reliability of electronic devices improve significantly. Projects are expedited and potential points of failure are eliminated in the field.
www.cieonline.co.uk
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