PCBs


From flat PCBs to miniature implantable 3D-Circuits


The most remarkable aspect of technology is its constant development and improvement. Slimmer laptops, smaller phones, and medical devices designed to be unobtrusive and barely visible to the naked eye. With this in mind, HARTING discusses whether 3D-Circuits can be used to outperform flat PCBs


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s electronic devices continue to evolve and shrink, so do their circuits and, ultimately, their components. This development has raised the demand for


component miniaturization. 3D-Circuits or also called 3D-MID (three-dimensional mechatronic integrated devices) makes this possible. It allows for more compact designs while enhancing functional density. In this article, we take a closer look at 3D-MID technology, what it is, its many benefits and its applications.


The miniaturization revolution in electronics


Smaller devices mean less environmental impact. A laptop, for example, uses 80 per cent less power than a desktop computer, with a peak power consumption of 60 watts compared to 175 watts for desktops. This reduction in energy use is due to miniaturization.


Miniaturization has revolutionized many sectors, from medical and healthcare to automotive as well as industrial and consumer electronics. Here are a few drivers of this movement:


Aesthetic demands: We have come to expect our devices to be visually appealing and well-designed. Portability: We also want our devices to be lightweight and easy to carry. Cost savings: While miniaturization can be costly initially, it allows for the use of fewer materials, which can save money in the long run.


Eco-friendly power consumption reductions: Smaller parts consume less energy which helps lower operating costs, increase battery life, and promote greener products. Less heat dissipation: Since smaller parts use less power, electronic devices generate less heat. This means bulky heatsinks or fans


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Hearing device: By integrating functions and the three-dimensional routing of circuit tracks, the design space for the electronics of hearing aids can be optimally utilised.


can be removed, reducing weight, cost, power, and noise.


Almost every industry is moving towards functional density, meaning that hardware components need to be interconnected and made smaller and smaller. 3D-MID is a way to fulfil those requirements by reducing mass and optimizing space while allowing for those parts to offer the same or more capabilities.


What Is 3D-MID?


The term “mechatronics” was coined in 1969 by a senior engineer of the Japanese firm Yaskawa. It is a combination of the words “Mecha” (machines) and “Tronics” (electronics).


Since then, the definition has evolved. It is now used to describe the abilities to use computers, electronics, and mechanics to build more intelligent systems, such as robotic, control, and electromechanical systems. 3D-MID stands for "Three Dimensional Moulded Interconnect Device" or "Three Dimensional Mechatronic Integrated Devices." These are mechatronic devices that combine electronic and mechanical functionalities into a


Components in Electronics www.cieonline.co.uk


single three-dimensional component. HARTING’s 3D-Circuits technology allows the 3D-MID parts or the injection-moulded thermoplastic part to be directly integrated with electronic circuits and components, making them more compact and functionally dense. Imagine a circuit board that is significantly smaller and composed of plastic rather than metal. Furthermore, injection- moulded circuit boards significantly reduce the number of production processes, assembly times, individual components required, and therefore lowering the production costs.


How does 3D-MID technology work? The flexibility of 3D-MID technology allows device designers to go where they need to. A three-dimensional component that combines electrical and mechanical functions allows for endless possibilities.


The designers lay down their requirements along with very specific measurements. The components are then constructed through


injection moulding. Injection moulding is when materials such as plastic are heated and melted before being injected into a mould and cooled to achieve the desired shape. It is a process often used by many industries because it enables the creation of parts with complex shapes quickly for mass production. Because injection moulding is so flexible, designers can use it to construct virtually anything with the exact specifications. Before realising a mould, different forms of simulation can be used to check if the parts fulfil the requirements and sample parts from rapid prototyping can be made.


Next comes laser activation through laser- direct structuring (LDS), a procedure created by LPKF Laser & Electronics in 1996. It is where a laser beam defines the conductive trace, etching the layout directly into the injection-moulded plastic component. The injection-moulded plastic will have special additives, which laser beams can detect. The lasers then reveal areas where the conductor structures will eventually be placed.


Component carrier: The 3D-MID component carrier is an in-house HARTING development which serves as a connecting element between a printed circuit board (PCB) and electronic components (such as LEDs, ICs, photo–diodes or sensors).


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