Sustainable Electronics
becomes a thermo-set synergy of parts it is rendered nearly useless for second-life. The level of recyclability is even less than the current technology of separate fibreglass resin-printed circuit boards, wiring and connectors. In some LCA calculations, the offset is significant towards the apparent lower part count and reduced logistics in production, but the inability to reuse at the end-of-life or recycle in a significantly effective way is not taken into account particularly well. So, as the industry moves from LCA comparators to full circularity assessments this will be an Achilles heel to IME and its equivalents.
Fully recyclable ‘integrated electronics’ solution
In2tec Ltd., a UK headquartered, sustainable electronics design, development and manufacturing company, believes it has the answers to the current issues. In2tec’s patented ReUSE technology provides the foundations for a fully recyclable ‘integrated electronics’ front shield. ReUSE delivers fully ’unzippable’ bonded conductive traces, printed sensors, and electronic and mechanical components onto a sustainable substrate,
Flexi-hibrid Circuit Assembly showing components in fi rst-life application within automotive shield, and transi- tion into eol second-life applications example is shown
such as PET, bioplastics, or nano-polymers. These systems are referred to as Flexi- hibrid Electronic (FHE) Technologies. The fl exible circuit board can be formed and laminated using ReUSE bonding materials to a pre-vac formed or injection moulded one-piece front shield. The rear of the front shield moulding incorporates cavities to house the components of the Flexi-hibrid sub-assembly, therefore fully protecting
the electronic components and sensors, whilst critically allowing full end-of-life disassembly and recyclability. The ‘harness’ or connecting system is also created using an additive process to the FHE substrate, creating a seamless and fully integrated interconnection system, thereby signifi cantly minimising connectors.
The In2tec solution - OMSE (On-Mould Sustainable Electronics) - gains all the
benefi ts of In-Mould Electronics, whilst also delivering the ultimate ability to completely disassemble the unit into its constituent parts at its end-of-life. The unzipping process - ReCYCLE - delivered at extremely low energy levels, using just hot water, allows the electronic components to be unstressed in separation, therefore providing for full second-life use. OMSE, is quite possibly the FIRST truly, fully recyclable solution. The more electronics are integrated into the exterior and interior of vehicles, the more we need to think about the impact of end-of-life recyclability. Ewaste is the fastest-growing waste stream globally. Over 58 million tonnes of electronics are shredded and buried annually. The premise that recycling electronics is a good thing, the way we do it today, does not hold true. We need to understand solutions for full circularity, to reuse at the end-of-life the parts that make up the virgin unit. We need to preserve our world’s fi nite resources and the automotive market has an obligation with its ever- increasing appetite to use electronics to move the game on.
www.in2tec.com
EASY ASSEMBLY ‘ENCLOSURE PRODUCT OF THE YEAR’ WINNER DUAL-ACTION LID: Screwless push-button or one screw assembly OPTIMISED SPACE: Large, unobstructed PCB footprint PCB FLEXIBILITY: Mounting bosses in base and lid
sales@camdenboss.com
www.cieonline.co.uk
+44 (0)1638 716101 Components in Electronics December/January 2024 39
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