TECHNOLOGY IN ACTION ADVERTORIAL


RS Components brings ‘The Engineers’ Playground’ to Electronica 2016


All the fun of the playground with robots battling and the latest gaming technologies showcased by RS at Electronica, Hall A4, Stand 241


New soft silicone flat EMI gasket material


metal wires orientated perpendicular to its surface. Excellent RFI/EMI/EMP shielding performance is achieved as the material has a wire density of up to 140 wires/ CM2 in solid silicone providing an environmental and RFI/ EMI seal when clamped between two metallic surfaces. The wires are crimped to aid compression and are chemically bonded to ensure retention. They also penetrate light oxide layers, ensuring a low contact resistance path when compressed.For applications with severe joint unevenness, low closure forces, and where greater compressibility is required, Kemtron have developed new grades 470/480 of material to fulfil a need that meets the performance of our oriented wire in silicone sponge but with improved environmental sealing qualities. We have achieved this by using a very soft solid silicone with a reduced wire count of 100 wires per cm2 the same as our silicone sponge. The advantages of these materials over silicone sponge are that we can manufacture sheet widths of 225mm with a minimum thickness of 0.8mm.


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Kemtron Ltd u 01376 348115


u www.kemtron.co.uk


flat, sheet material, comprising a solid silicone rubber, embedded with Monel or Aluminium


Munich, Germany, November 8-11, Hall A4, Stand 241. As well as presenting all the latest innovative products and technologies from across the electronics industry in areas such as Internet of Things (IoT) applications, a special focus of the RS stand this year is to play host to all the fun and excitement offered by electronics technologies. Throughout the week, RS will be running a live ‘Robot Clash’ event on the stand, offering visitors the chance to do battle with robots and win prizes. The stand will also have a gaming arena, including game consoles from the 1980s right up to the very latest modern virtual-reality games. Visitors will also have the chance to walk away with their very own VR headset.


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RS Components u 0795 400651


u www.rs-online.com


First COM Express Type 7 modules with Intel® Xeon® D processors c


S Components (RS), the trading brand of Electrocomponents plc (LSE:ECM), the global distributor for engineers, will be showcasing ‘The Engineers’ Playground’ at the 27th Electronica Trade Fair in


ongatec is introducing new Server-on-Modules with Intel® Xeon® D processors (codename Broadwell) parallel to the preview release


of the COM Express Type 7 specification. Based on the world-leading COM Express Basic standard form factor (95 x 125 mm), the modules feature 10 Gigabit Ethernet interfaces, 32 PCIe lanes and headless server performance currently with up to 16 server cores and 48 gigabytes of DDR4 ECC RAM. Examples of target applications for the new Server-on-Modules are industrial automation, storage and networking appliances as well as modular server designs and base


stations for telecom carriers, service providers‘ server farms as well as cloud, edge and fog servers for IoT and Industry 4.0 applications. The COM Express Type 7 pinout is part of PICMG’s COM Express 3.0 specification which is scheduled for release later this year.


Congatec AG u +49-991-2700-0 u www.congatec.com


Panasonic showcases wide range of industry leading technologies and components at Electronica 2016


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atest solutions for wide range of electronics applications on display: new X- GaN gate driver, Soft PGS thermal management solution, latest passive


components, pressure and infrared array sensors, electromechanical and automotive solutions


Panasonic Automotive & Industrial Systems Europe today announced its technology line-up for Electronica 2016, taking place November 8th – 11th in Munich, Germany. At Stand 105 in Hall B6 the company will be highlighting industry-leading innovations — including GaN semiconductors, thermal management products, batteries for industrial use, passive components, sensors, electromechanical, as well as automotive solutions — that provide increased efficiency and reliability for a wide range of applications.


X-GaN high frequency and reliable power switching solution


As GaN power switches are transitioning from advanced technology to a reliable, energy saving power switching solution, Panasonic will be exhibiting devices and applications that harness the power of their gallium nitride power technology. The newly released X-GaN™ gate driver, optimized for high frequency switching, unlocks the full performance of the company's line-up of 600V enhancement mode X-GaN transistors, while keeping design efforts to a minimum. Panasonic will demonstrate the system size reduction potential of high speed and high efficiency switching with application examples, like an ultra-compact AC adapter and a motor drive unit for mechatronic integration. The GaN evaluation environment, and the line up of GaN power transistors, will also be featured on the stand.


/ ELECTRONICS New Lithium-ion Pin-type & Flexible Battery


Panasonic will introduce its new Li-ion Pin Type Battery, the industry’s smallest diameter cylindrical rechargeable battery on the market. It has been developed using extremely fine components and materials compared to standard Lithium- ion batteries. Its outstanding technical design makes this battery suitable for wearable devices with heavy power demands. Also on display will be the newly developed rechargeable Flexible Li-ion Battery. With a thickness of only 0.55mm the battery contributes to a longer life of devices as it retains charging and discharging characteristics even with repeated bending and twisting. This battery can meet various market needs for applications entailing repeated bending and twisting such as card devices and smart clothing.


Soft PGS for IGBT modules – Ideal TIM Solution; solves problems of Thermal Grease and PCM


On display will be Panasonic’s cost-effective and easy to install Soft PGS solution for IGBT modules. It is an ideal TIM (Thermal Interface Material) solution and solves the issues of Thermal Grease and PCM. The high compressibility of Soft PGS helps reduce contact thermal resistance due to better fitting to uneven surfaces (compared with Panasonic’s regular PGS thermal management solution). The high reliability and thermostability of Soft PGS can significantly increase the lifetime of IGBT modules.


Panasonic u01908-231555 u www.panasonic-electric-works.com


ELECTRONICS | OCTOBER 2016 S19


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