TECHNOLOGY IN ACTION ADVERTORIAL


Smiths Interconnect receives contract from General Atomics to develop multi-function RF microwave assembly for Air-to-Air Radar System


and cable assemblies for Aerospace and Defense, announced the award of a development partner contract from General Atomics Aeronautical Systems, Inc. (GA-ASI) to design a multi-function microwave transmit and receive assembly ideal for Radar and Military Data Link communication applications. GA-ASI is working with the Federal Aviation Administration (FAA) to develop a Technical Standard Order (TSO)


S


Smart Touch Displays in a compact format


or control unit the operating convenience of a tablet. With integrated graphics controller, extensive graphics func- tions and numerous interfaces, the displays are ready to run without additional peripherals. Only three fingers wide is the smallest variant from


W


Electronic Assembly's new uniTFTs series. Nevertheless, this capacitive touch display has a resolution of 320 x 240 pixels on its 2.0 inch screen diagonal. In addition, this series is currently also available in 2.8 inch (320 x 240), 3.5 inch (480 x 320) and 4.3 inch (480 x 272) diagonals. The brilliant color displays are using improved IPS-


Panels with AACS technology (All Angle Color Stability). Contrast and colors are retained even at extreme viewing angles. Unlike commonly used TN-Panels these displays do not have an inverse tilt effect.


ELECTRONIC ASSEMBLY GmbH u +49 (0) 8105-77 80 90 u www.lcd-module.com


Pickering Interfaces


ith the uniTFTs series, Electronic Assembly offers a range of small touch displays that give every switch


compliant Air-To-Air Radar (ATAR) for a Traffic Surveillance System that would enable routine flights of unmanned aircraft in the U.S. national airspace system. “Our multi-function microwave assembly is rugged and compact in size, ideal for radar and military data link


communication applications and suited for harsh airborne operating environments. We are very pleased to be part- nering with GA-ASI to offer fast, reliable and efficient system designs on and off aircraft worldwide,” said Ralph DeMarco, Vice President of Business Development and Sales at Smiths Interconnect Inc.


Please visit our u www.smithsinterconnect.com


Versatile LVDT/RVDT/Resolver Simulator Module P


miths Interconnect, a leading provider of technically differentiated multi-func- tion RF systems, subsystems, antennas, RF and MW components, connectors


ickering Interfaces launched its model 41-670, a single module that can function as an LVDT, RVDT or resolver simulator. Occupying just one PXI or


LXI chassis slot, the programmability of the module means that it minimizes the amount of hardware required. Also, since it sits in a PXI chassis alongside a customer’s other instruments, additional control protocols/interfaces are not necessary, simplifying operation. The 41-670 can handle up to four channels of 5/6-wire LVDT/RVDT or


resolver, or eight channels of 4-wire LVDT/RVDT simulation. Each VDT bank has an independent excitation input, as well as the ability to use an internal- ly generated excitation signal. It can operate with a shared excitation signal to each channel for synchronous test. Several models are available that sup- port excitation voltages ranging from 0.25 VRMS to 38 VRMS and frequencies from 300 Hz to 20 kHz, meaning the 41-670 family can simulate a wide range of LVDT, RVDT, or Resolvers.


u +1 978-455-0376


Lattice Extends Industry-leading Security and System Control to Automotive Applications


FPGAs for flexible deployment of robust automotive control applications and MachXO3D™ FPGAs for system security that support extended temper- ature operating ranges for automotive and other ruggedized applications. MachXO3D FPGAs augment the popular system control capabilities of the Lattice MachXO FPGA architecture with industry-leading security features,


L


including hardware Root-of-Trust (RoT), platform firmware resilience (PFR), and secure dual-boot support. The MachXO3D and MachXO3LF devices target control, bridging, and I/O expansion applications that must operate reliably in rugged environments, including advanced driver assistance systems (ADAS), infotainment, motor control, 5G com- munications infrastructure, industrial robots and automation systems, and defense systems. Emerging trends like electric vehicles (EVs), autonomous driving, ADAS, and infotainment are increasing OEMs’


reliance on electronic components in automotive systems. Lattice Diamond


u https://www.latticesemi.com/Diamond


OMRON launches precise and flexible 3D Time-of-Flight Sensor Module


positioning, autonomous-guidance, and proximity sensing for a wide range of applications. Commenting, Gabriele Fulco, European Product Marketing Manager Sensors at OMRON said, “Our new sensor is a “mechanical eye” that is capable of accurately and easily detecting the surrounding environment, which will contribute to the more wide- spread use of autonomous robots as well as the automation of various other machinery and equipment. OMRON’s new B5L can be fitted to moving objects such as autonomous mobile robots, to provide real-time contextual informa- tion such as guidance, collision avoidance, and cliff detection. Alternatively, located in a fixed position, the sensor can accurately detect moving objects in the field of view. It is thus suited to use in automated packaging equipment, security systems, intruder detection, and patient-monitoring and elderly-care systems.”


O


OMRON Electronics Components Europe B.V. u +31 235 681 296 u http://components.omron.eu


CONNECTINGINDUSTRY.COM/MAGAZINE


MRON Electronic Components Europe has unveiled a new precision time of flight ranging sensor that delivers a convenient, modular solution offering


attice Semiconductor Corporation (NASDAQ: LSCC), the low power pro- grammable leader, today announced new versions of its MachXO3LF™


High Frequency Composite Materials meet the


requirements for SiC and GaN applications


tions. The material plays a decisive part in this. SMP has developed "All Mode" EMC filters with high frequency sta- bility. The High Frequency Composite Materials (HFCM) developed and manufactured by SMP are effective for fre- quencies up to the gigaHertz range and satisfy all of the requirements to which modern SiC and GaN applications are subject. The All Mode design damps both differential mode and common mode noise. By combining HFCM and All Mode technology it is possible to reduce the number of fil- ter components needed in the system by about 50 percent. Among other advantages, this also means that common mode chokes or filters can be dispensed with. Compared to standard technologies which use materials such as ferrite, electrical steel sheets and nanocrystalline ribbon, EMC fil- ters from SMP are noiseless, up to 40 percent lighter, and reduce interference levels by as much as 40 dB[µV].


E


SMP Sintermetalle Prometheus GmbH & Co KG u +49 (0)7255 716 0 u www.smp-online.com


ELECTRONICS | OCTOBER 2020 39


MC filters reduce interference currents and voltage spikes in power converter systems and other applica-


u www.pickeringtest.com


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46