PRODUCTS RACKS, CABINETS & ENCLOSURES STAY COOL AND REMAIN RESPONSIVE TO CHANGING I.T NEEDS W
hen data-driven businesses expand their computing
environments and install the latest class of servers, the issue of cooling the equipment becomes acute. Legacy air-cooling systems are no longer sufficient. The Rittal LCU DX and LCP DX
solutions deliver enclosure-based cooling via direct expansion units. The units are easy to install simply by mounting them on the side panels inside IT racks. Expanding a small-scale, air-
cooled IT hardware environment to create a multi-enclosure facility often calls for a new cooling strategy. The first question is whether water-based or refrigerant-based cooling is more appropriate. It also makes sense to understand the total cost of ownership – including capex and opex costs. Direct expansion (DX) solutions employ
conventional refrigerant-based cooling with a split system and a compressor. Cooling is via a closed-loop refrigeration cycle, featuring an evaporator, a compressor, a condenser and an expansion valve. Rittal’s LCU DX (Liquid Cooling
Unit) offers enclosure-based cooling with DX units mounted inside 800 wide IT racks. They are available with up to 6.5 kW output in both single and dual redundancy variants.
The LCP DX (Liquid Cooling Package) rack cooling unit can be mounted on the side of an IT enclosure, enabling a single device to cool two enclosures.
www.rittal.co.uk
Hylec-APL has announced a new 20mm diameter member of its venting element family, which protects sensitive circuitry from the effects of moisture. When an enclosure is exposed to
DIN RAIL ENCLOSURES AVAILABLE IN A RANGE OF VARIANTS
OKW has introduced flat/high RAILTEC B DIN rail enclosures that accommodate connections at different levels and offer extra space. The universal DIN rail enclosure, that meets machine-building and motor industry regulations, can be mounted on TH35 DIN rails or directly on walls for applications including control equipment, notably lighting systems. Various versions are available – with or without ventilation – for PCB terminal blocks; plug headers; front connectors (closed case) and D-SUB connectors. Open case enclosures enable the fitting of different combinations of terminal guards. The new flat/high variant is available in two, four, six and nine modules (pitches 5.0/5.08 mm) – offering
sizes from 35 x 86 x 58 mm to 157 x 86 x 59 mm. RAILTEC B is fully insulated and protected to VBG 4. It is
moulded from light grey (RAL 7035) polycarbonate (PC, UL 94 V-0) as standard. Prices start at £5.40. Accessories include a bus system for enclosures that share common power and data connections; wall suspension elements; terminal blocks; plug headers; self tapping screws (2.5 x 6 mm PZ1) and transparent lids. OKW can supply RAILTEC B fully customised ready for
PCBs. Services include EMC shielding; CNC machining; lacquering; screen, tampo and digital printing of parts and labels; membrane keypads; display windows; plastic and aluminium panels; installation and assembly of accessories.
www.okw.co.uk
changing temperatures, the air inside will expand and contract as it heats and cools respectively. As the air contracts, the internal pressure decreases and air is forced in. This air contains moisture which can condense causing damage to electrical and electronic systems. Even if an enclosure is in a stable environment, water ingress can still result from heat caused by the system itself. Hylec-APL’s venting elements can be
quickly installed on the wall of an enclosure, ensuring that the pressure inside an enclosure is maintained at the same level as it is externally, so no moisture-carrying air is drawn inside the system and condensation is avoided. Mark Severn, director of sales for
Hylec-APL, said: “Our low cost venting elements are as easy to install as a simple cable gland and can prevent failures which could cost thousands in lost productivity and repair bills.” As well as the M20 20mm diameter
venting elements, Hylec-APL also supplies M12 and an M40 version is available too.
www.hylec-apl.com
VENTING ELEMENTS PREVENT CONDENSATION
32 MAY 2017 | ELECTRONICS
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