FEAT RE WIIR FEA ATURE
RELESS TECHNOLOGHNOLOGY
ULTRA-SMALL WIRELESS MODULES g
NickWo T
fectivesolutions.Thismake RFintoasinglepro andincre
manufa effe
ff
nportportableelectro facturersto veso
od ev roductmore
timethepro
reduced.Sys pro ext
re
rov xte
st
ovidingacompletesyst ternallylike
semiconductors,passive Sys
kemilitaryandaero mainstre
ry be stacked owev he heincre ckWood,, P Presid
iie ve rers todelive eve
reaseddemandfo ronicdev verev
re to squeeze i creasinglymore funct onal y into eve to squeeze increasingly m re functi forwire relessconnectivity
eviceshasdriven ver-smaller,
kestheintegrationof reandmorecomplex
r,more ra
velopmentcyc ex
reasestechnical riskwhileinthemean roductdeve
ystem-in-Pa kage
QFNpackagekage),butwhichinsideareincre sophisticatedsys rs
but initiallywereconfinedto like
ystem-in-pa kage ec were
“memorychips”inre numberof st ke Howeve ove
mov fa
vedbey farmore recomplexso
thetwindemandsofslim elega eve
vendors tw
gantphys ev
sophistication. Sowhatare roa
ver incre st
raditionalPCBmodules, the componentsare withoutcompro
thisappro tra
rf
theprice.Andall thetra moduleappro
od oa
designer toge nvo hav
rt
xampleof ow thedesignpro technology
exa gy.Buildingonthesuccessof its
ISP130301module, thecompanyhaslaunchedthe ISP1302moduletoof whilst st quality
od oc
off still re tycharacteristicsof
TYPCA APPLCATI REQUIREMENTSNTS
oday'sSmart
retainingthehighpe formanceand ra ri
m rs rf
Foranumberofye rsInsightSIPhasbeen designingSIPbasebasedRFmodules,fo Wi cellularfro intod od
TYPICALAPPLICATIONSAN REQ Fo
ofyears od rontends,manyof modules, itisnow 30 30 JUNE 2016 ff fer
rtphones.WithitsBluetootetoo owabletooffe
ec JUNE 2016 || ELEC RO ELECTRONICS CS
YPICALAPPLICATIONS ANDINDUS EQUIREMENT
AND INDUSTRUSTRYSTRY be
forWiFi,GPSor ofwhicharetoretobefo
thistechnologynot othSmart
found rt
gy ot
ffercusto ersawiderchoice, rfo
of theInsightSIPdesign. avingacertifiedpro rea
reaminthememory ry
yondSIPsfo st
keasinglecomponent (likeachipina re
Packageisawa of systeminwhat looksooks ke
reasingly
ystems, thatcanincorporaporate vesandRFcompo
ponents.
packagetechniquesarenot ew, tospecialistapplications rs
re otnew
rospace.Theyfirstentere ryma kerket,andmost reSIPswitha
ealityare
ver thetechnologyhas eyo
basedonSIPtechnology theve
mobilephoneisincre ba
rsstruggleto y,
edsemiconduct gy
formemory
solutions.Th reasingly gy,as
r tomeet ysicaldesignand reasingtechnological
retheadva tage o oach?Incomparisonw PC
resmaller inalldi romisingperformfo
roach–ofre ov get inv ve
equallytrueforu foraSIPmodule. Thenew
vantagesof
i f
e y
bi “The
increasingly based on SIP chnol gy as vendors struggle tomeet the twin deman s of slimds of slim elegant physical design and ever increasing technological sophistication
technology,
increasingly y,
ly based on SIP ogy, as vendors st
to m et the twin dem hy
ggl
elegant physi al design and ever increasing technological sophistication ...”...”
a , m
g
volvedinco plexRFaspects, rod
oductandsoonre od
ewISP1302modulefro forchipset re remain
ofhowSIPcanaddsignificantvalueto rocessfo
etsrequiringRF
romInsightSipisan va
Figure 1& 2: Figure 1& 2:
The new I P1302 module
he new ISP1302 module Thenew themarke “Low
ewmodulesaresoresomeof ket
od
withathicknesslessthan1mm. TheISP1302mod owCost”opt
odulehasbee tocompro ra size,andstillwa vemarke etatonly8x8mminx/ ptionaimedatcusto
of thesmalleston x/y
/ydimensions, eendesigned romiseonradioperfo rf edasa
unitpriceiscritical,butat thesametime,donot wantto
critical.Ahighendpro late
component.Themod customers sensitive ri
ter thisye od
Nord
Themoduleinte year.
rdicSemiconductor-offofferfferiinga32bitARM
tegra to
wantafullyfunctional,cert oduleisthusid al for
e fo rsseekingtoaddre
kets,andapplications heresizeis rod
resshig vohvolumecost w re
oduct (ISP1507)will followfo ow Insight SiP
ratesthenRF51822chipfrom RM
ro
www.insightsip.com T: +33 (0) 493 008 880
www.insightsip.com / ELECTRONICS ELECTRONICS
formanceor rtified
to ersfom rs forwhom ot
raditionaladva tagesof removingtheneedfor the m ex
vantage of the fo
“The mobile phone is phone i redthe
justtohighvo phonemarke
volumepurc ket,butalsotothege
M m u o
C S
rchaserssersinthemobile ra
designcommunity.TheInsightSiPBluetoo lesisdesignedintomany nssuchastempera rement(ST pera
rature re STEMPSmart
peraturePatc icro
ylva rePatch),ga rotrootronicsH2Ssenso
re rt
gasmeasurement sor), industri
re rial
ontro TeepTrak),we ra monitor(Ari(Arion),Ve Syvac),carparkba omThings
ff ffereferentendmarke ets.
rol(Te pTrak) wearablefitness VernierCaliper barriercontrol re
ro
gs)plusmanymore ket
ot
generalelectronics ooth
ro
yclehastobe wayof
recost of
ident a Insight SiP ex Insight SiP explains howexplains how design engineers can use SIP (System -in-Package) ionality i to ever smal r spaces for next generation devices
t at
owdesign engineers can use SIP (Sy ve
Corte dig est
rt ta giitalpe ka ev r smaller spaces for next generat on devi ,
stablishedleaderintheBluetooetoot Combinedwithaninte ra ed
othLow rg odulewillbefullycert fo
texCPU,128kBflashmemory periphera ed
ralsSPI
I2CandGPIO.Nord othchipset
gy
ry,analogueand rdicisthe etmarke
antennaandmatchingcrcircuit,thismodulefo standaloneBluetooetoot mod
owEnergynode.The rtifiedforgloba
KE DESIGN CONSIDERATRATIIONSFO TOP STRYDEMAN requiri
KEY ES CO INDUS
traditionaldiscre od
EYDESIGNCONSIDERATIONSFOR O FORTOP INDUSTRUSTRY DEMANDS Applicationsre connectivity ra
ANDS ringS artm rtBluetooetooth
orusingamodularappro individualcomponentsa
functionsare rov
withsimpledigital interfterfa have
repro gi
vetheiradva Thediscre
vantage reteappro
tycanbedesignedusingeithera reteappro po
roa ro
ovidedasfullyfunctionaldevices
faces.Bothapproaches nv
gesandinconve veniences. roachmayappear tobethe
BeingRFbased, theapplicationhastobe independentlycert
rtifiedfo ra
compliance.Thesumof thetot anypot
po pro
volumesoflessthan300kunitsgenerallyfavour themoduleappro of
withlowri k,noextraxtracert generallyamore of
ge vo
ra od roa
of1millionunitsmaybe addre ed
ressedwithadiscre od be ret recompactove re
rtificationcostsand ov raveralldesign.Ove ge
ra
oachwhereasvo bemore
WhenusingtheISPra geofSmartBluetoot modulesthere revery ew apart frort rombeingcare antennaare
eteapproach. rangeof
rea port eaisdev
togetherwithext that oftw
softw rethatpro thebox complet toge
Tosupportpro acompletedev softoftware bo
eve evo of ovidesev ternalse roductdev
oxtost rt eve etebread oard
startdev
atsoftwaredev withhardware
ftware eve dw
voidofmetal. eve
eve yt verythingrequire
ry ki
re eve velopingaso
eful toensure et
rs rt
reareveryfewspecial require ref
re oo rethat the velopers, InsightSIPoffersff rs offe
velopmentkit togetogetherwithsample rov
redoutof ed
readboardcanbebuiltusingtheki xte
sensordev rdwaredesign. ocee of
solutionondayone.A kit ki
velopmentcanproceedinparaparallel gn
velopmentkitsso ro
fective avo
recosteffe vely ro
volumesinexc ff
oth rements od od
Themoduleappro roductioncost theadva
dv gesof oa
otal"timetomarke otentialpro od
roduction roach
re
rcuit includingimpedancematchingandthe antennaisof poo Be
ofdesigningtheRFport tc
ove oftenunderest ft oorperf rfo formanceand/o verruns. forradioandBluetoo ot
cheapestmethod, lookiookingatcomponentcost; howevewevowever thismayignore Thecomplexityof circ
remany“hidden”costs. of
rtionof the
restimated,andcanleadto /orscheduleov
oothSiG
of thesehiddencostsand ket"frequentlywipeout be
hasaslightlyhigher costbenefit.
vantage ofmuchlow owrisk,
st thanth discreteone,butoffersff rs owerdev
e screte eve offe
velopment time st
Ov raverall, fav
xcess
remountedonthePCB roachinwhichsomeof the ev
oachinwhichall the re
PC of
tegrated16MHzcrystrystal,RF od
balmarke kets.
Systems-in-Package) ev ces
ket. formsa
ULTRA-SMALL WIRELESS MODULES using the latest SIP technolo y
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44