PRODUCT SHOWCASE Board support OctalNAND and DesignWare integration W D
irect Insight has cre- ated a QNX 7 Board Support Package for Toradex’s Colibri iMX8X em- bedded computing modules. Toradex Colibri iMX8X mod- ules feature the NXP
i.MX 8X family of embedded SoCs, in- cluding the top-tier
i.MX 8QuadXPlus (
i.MX 8QXP) with four Cortex-A35 cores - cur- rently ARM's most efficient ARM v8 core as the main processor cluster. The SoCs provide full 64-bit ARM v8-A support while maintaining backward compatibility with
32-bit Armv7-A software.
www.directinsight.co.uk
Colour film G
TK has added colour film technology that sits be- hind the PMVA glass and enables the use of up to 12 colours, which compares favourably with colour printing technology, which only allows a maximum of 4 colours. PMVA displays have the added advan- tage of excellent contrast ratios as well as operating in a wide temperature band, ranging from -30°C to 85°C.
PMVA displays are fundamen- tally monochrome products but technology, in the form of colour printing, LED arrays and colour film, has enabled OEMs to add colours, resulting in exceptionally reliable and cost-competitive products that can be integrated
into new designs rapidly.
www.gtk.co.uk
inbond Electronics Corporation, has announced the successful interoperability of Synopsys’ DesignWare Synchronous Serial Interface (SSI) IP and Winbond’s OctalNAND Flash Memory. The DesignWare SSI IP, offering high transfer rates and low la- tency in serial flash memories and OctalNAND Flash deliver a complete NAND flash memory solution for automotive, mobile and IoT SoCs, en- abling faster adoption of octal non-volatile memories (NVM) with high- speed read bandwidth in densities up to 4Gbit.
Winbond’s OctalNAND Flash enables automotive, communications, and industrial system manufacturers to provide embedded code storage in high density and in the same form factor as NOR Flash. Winbond developed OctalNAND Flash because flash suppliers are reaching the limits of NOR technology’s ability to provide high-density NVM cost effectively while still being assembled in industry standard packages.
www.winbond.com
COM Express Type 6 module
MIKROE’sFUSION development board
ortwell has launched PCOM-B655VGL, a new COM Express Type 6 module. PCOM-B655VGL is powered by Intel’s 10th Gener- ation Core i3/i5/i7/i9 desktop processors and Intel Q470E/W480E chipset to pro- vide optimised computing performance and power con- sumption.
P
Featuring up to 10 cores/20 threads with a low 35W TDP in LGA1200 socket,” says Lee, “the basic form factor offers long life product support of 10+ years and can support multi- ple displays including DP, HDMI, LVDS and VGA. PCOM-B655VGL can deliver superior perform- ance in various environments, making it the optimal choice
for many applications.
www.portwell.eu
MikroElektronika (MIKROE) has launched FUSION for PIC v8, offering universal support for PIC, dsPIC, PIC24, PIC32 microcontrollers on one board. FUSION development boards are ideal for rapid pro- totyping and are equipped with everything that engineers re- quire for their newest project development. Redesigned from the ground up, FUSION for PIC v8 includes SiBRAIN sockets. SiBRAIN is the new universal standard for MCU cards enabling great flexibility for embedded design. Five mikroBUS ‘Click’ peripheral board sockets are also positioned on the FUSION for PIC v8 development boards, enabling users to try out more than 1000 different peripherals. Display board standard sockets also feature, providing a choice of four different sizes of TFT capacitive and resistive touch displays. The FUSION boards also integrate CODEGRIP, the world’s first tool that facilitates de- bugging over Wi-Fi. The on-board CODEGRIP USB-C debugger and programmer currently supports more than 1640 microcon- trollers, and enables development in hazardous environments, or remote and inaccessible sites.
www.mikroe.com
SEGGER’s RTOS embOS receives ST quality label
SEGGER’s real time operating system (RTOS) embOS has been awarded STMicroelec- tronics’ "MadeForSTM32 v2” certificate. MadeForSTM32 is a quality label granted by ST after an extended evaluation process. It helps engineers identify software solutions with the highest level of integration, mainte- nance, and service support to improve time
46 JULY/AUGUST 2021 | ELECTRONICS TODAY
to market and the quality of their solution. Version 2 of the MadeForSTM32 label ex- tends the interoperability of the STM32Cube Expansion packages, easing the application integration within STM32CubeMX and STM32CubeIDE software development tools. embOS was one of the first solutions to earn the MadeForSTM32 (v1) label in an ad-
vanced collaboration of SEGGER and STMi- croelectronics and now has been granted MadeForSTM32 (v2) as well. As a result, SEG- GER has published the official I-CUBE-EMBOS expansion for STM32CubeMX, which may be used to generate ready-to-go embOS proj- ects for virtually all Cortex-M-powered STM32 devices.
www.segger.com
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