TEST & MEASUREMENT
The industrial sector has traditionally utilised other methods considered inferior compared to what is being used in today's semiconductor industry. However, with SAM equipment, specialty materials
manufacturers can achieve the same level of failure testing to the companies that make metals, alloys, composites, and titanium plates used in electronic devices. OKOS has leveraged the lessons and the tight specifications from the semiconductor world and adapted its SAM scanning systems for various form factors and provides solutions for specialty crystalline, metals, and other material. With this type of testing, it is possible to inspect materials at a level one to two orders of magnitude better to discover flaws that were previously undetected.
Detecting Flaws with SAM SAM is a powerful non-invasive and non- destructive method for inspecting internal structures in optically opaque materials. Depth-specific information can be extracted and applied to create two- and three- dimensional images without the need for time-consuming tomographic scan procedures and more costly X-rays. The advantages of SAM include ability to penetrate deep into the material, ability to detect discontinuities in thickness, and ability to detect moisture related defects. SAM works by directing focused ultrahigh frequency sound from a transducer at a tiny point on a target object. The transducer probe is the main part of the ultrasound machine and creates the sound waves and receives the echoes. Transducers differ for specific applications; Selection is based on sample thickness, sample materials, and number of layers in sample. As a result, transducer probes come in many shapes and sizes. The shape of the probe determines its field of view, and the frequency of emitted sound waves determines how deep the sound waves penetrate and the resolution of the image.
Ultrasonic testing (UT) is a family of non- destructive testing techniques based on the propagation of ultrasonic waves in the object or material tested. The sound as it passes through the material is either scattered, absorbed, reflected, or transmitted. Detection of the direction of scattered pulses and measuring the TOF "time of flight," the presence of a boundary or object is determined and its distance. Three- dimensional images are created by scanning point by point and line by line on an object. Scan data is digitally captured and processed by special imaging software and filters to resolve a specific area of focus in either single or multiple layers.
JULY/AUGUST 2021 | ELECTRONICS TODAY 25
Today, much of the SAM equipment can inspect various items with unique product geometries or sizes, from crystal ingots, wafers, and electronics packages to miniature physical packaging, metal bar/rods/billets, turbine blades, etc. However, as important as the physical and mechanical aspects of conducting a scan, the software is the key to analysing the information to produce detailed scans. For this reason, OKOS decided early on to deliver a software-driven, ecosystem-based solution. The company’s ODIS (OKOS Digital Imaging System) Acoustic Microscopy software offers rich technical content built on current platforms and industry feedback. Advanced analysis is provided through quantitative tools for measurement and classification of parts. Defect detection is possible in multiple zones, near surface, sub-surface and inside parts.
The software supports a wide range of transducer frequencies from 2.25 to 230MHz. Multi-axis scan options enable A, B, and C- scans, contour following, off-line analysis, and virtual rescanning for composites, metals, and alloys, which result in highly accurate internal and external inspection for defects and thickness measurement via the inspection software.
The company’s software-driven model makes it possible to drive down the costs of SAM testing while delivering the same quality of inspection results. As a result, this type of equipment is well within reach of even modest testing labs, R&D centers, and material research groups.
Every company will eventually move towards this level of failure analysis because of the level of detection and precision required for specialty metals and materials. The cost advantages and time savings of Industrial SAM equipment make this possible. SAM systems have an integral role in semiconductor device manufacturing based on their precision, usability, and time-saving advantages compared to other NDT options. Extending this testing methodology beyond semiconductor components to specialty metals and materials throughout a semiconductor device can provide more robust failure detection capability for manufacturers of consumer, industrial and military electronic devices.
OKOS
www.okos.com
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