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UDE SUPPORTS NXP MCUS WITH HIGHLY EFFICIENT DEBUG AND TEST FUNCTIONS T


he latest version of the PLS Programmierbare Logik &


Systeme Universal Debug Engine


(UDE) provides comprehensive debugging and system analysis functions for NXP’s Arm-based S32S247 and i.MX RT high-end MCUs. The S32S247 multi-core controller combines four Cortex-R52 processors clocked at up to 800MHz, each with a lockstep core, with 16MB integrated Flash memory. Designed for safety-critical real-time processing up to ASIL-D, the device addresses a wide variety of control domains, primarily in vehicles with


hybrid and electric drives. The up to sevenfold higher computing power compared to the previous generation provides a wide variety of potential applications for the MCU in the field of autonomous driving. The i.MX RT Crossover processors


equipped with an Arm Cortex-M7 can be clocked at up to one gigahertz, depending on the version. With their high-performance and real-time functions, they address a broad range of applications in the


fields of Internet of Things (IoT), consumer electronics, industrial electronics, and automotive. In both cases, developers benefit


from the simple intuitive operation of the UDE’s own user interface for debugging and system analysis. Neither entry into the UDE nor the changeover from another microcontroller architecture to the new NXP devices requires a great deal of familiarisation effort. www.pls-mc.com


Want to keep up to date? Then follow us on Twitter: @ CI_ Electronics and/or ‘Like’ us on Facebook!


SONY LAUNCHES VISIBLE AND SWIR BASED IMAGE SENSORS


Two new image sensors have been launched by Sony Semiconductor Solutions that include both the visible and short wavelength infrared (SWIR) ranges in captured images. The sensors utilise the smallest 5µm pixel size of any InGaAs based sensor. These sensors use Sony’s original SenSWIR technology and are SXGA 1/2-type and VGA 1/4-type imagers that are being made available by FRAMOS. Both these products utilise a 5µm square pixel that can capture light wavelengths that are both visible and nonvisible to the human eye. The spectral response of these sensors is between 400nm-


1700nm allowing them to detect and see into the SWIR range while not sacrificing too much within the visible spectrum ranges. This is partially achieved through thinning of the top Indium Phosphide (InP) layer, placed above the indium gallium


arsenide (InGaAs). This thinning allowing the shorter wavelengths, those in the blue light range, to pass through and be absorbed in the sensitive InGaAs region. This sensing layer is then connected to the readout circuitry through Cu-Cu connections that help them deliver high quality images in a compact design. Additional outer memory provides real-time optical black (OPB) dark level information without the need for external dark current correction (DCC). The IMX990 1.34 MP sensor has a 1296 x 1032 active pixel


array that can be streamed at 130 fps @ 8 bits, 120 fps @ 10 bits and 70 fps @ 12 bits. The IMX991 0.34 MP sensor has a 656 x 520 active pixel array that can be streamed at 250 fps @ 8 bits, 240 fps @ 10 bits and 130 fps @ 12 bits. www.pls-mc.com


Farnell has added the new Tektronix TBS1000C Digital Storage Oscilloscope to its portfolio. Designed for educational institutions, embedded design engineers and makers, this new oscilloscope offers an upgrade in performance over the TBS1000B.


www.farnell.com PCIE M.2 BGA SSD A


s lockdown begins to ease and some normality begins


to return we can all start to focus on working life again. With this issue we bring you a bumper joint issue packed with all the latest news and industry updates. Don’t miss our cover story


exclusive interview with Rochester Electronics on p14. We also have a spotlight on test and compliance with the latest updates from Anritsu Corporation on p16 and congatec p19. TUV SUD talks about the latest military standards update on p20. Plus we also have special focuses on industrial, power electronics, enclosures and medical. Michelle Winny Editor


4 JULY/AUGUST 2020 | ELECTRONICS


Swissbit has launched a new single chip solution which offers high speed PCIe SSD performance in a 3.2cm² BGA package. The device acts as a true industrial grade SSD with up to 480GB capacity and 4 lane PCIe 3.1 / NVMe 1.3 specification. It enables high performance and high reliability for small size embedded systems, factory automation, routers and switches, Internet of Things (IoT), cloud computing, and medical systems. The EN-20 product series features


industrial grade 3D NAND supporting an ambient temperature range from -40°C to 85°C. The managed device combines high grade NAND Flash chips, a sophisticated PCIe controller and firmware that supports demanding applications. The PCIe 4 lane interface with backwards compatibility to single or dual lane system designs operates according to the latest PCIe 3.1 specification and offers high bandwidth up to 1600MB/s for sequential read and 770MB/s for sequential write. Random performance surpasses 145,000/


130,000 IOPS for read and write and nearly doubles the bandwidth of SATA SSDs. The single chip has a dimension of


16 x 20mm and a 0.8mm pitch compatible with standard PCB routing guidelines. For low power consumption without sacrificing performance, EN-20 substitutes a local DRAM cache by using the HMB (host memory buffer) feature, which uses system DRAM memory to maintain the flash translation table. Intelligent thermal management protects the long-term stability of the controller and maintains a continuous bandwidth even at high temperatures. Other reliability and security features


are End-to-End Data Path Protection (ETEP), AES 256 encryption, LDPC error correction with full page fail recovery and a protection against sudden power loss. Data care management adds extra protection of the stored data at high operating temperatures. The NVMe protocol has been designed to efficiently use the bandwidth with a native nonvolatile memory command set resulting in ultra-low latency. www.swissbit.com


Renesas Electronics Corporation has announced that more than 20 of its radiation-hardened (rad-hard) integrated circuits (ICs) were onboard the July 30 lift off of NASA's Mars 2020 Perseverance rover. A United Launch Alliance (ULA) Atlas V rocket, with the Perseverance rover and Ingenuity Mars Helicopter onboard, launched from Space Launch Complex 41 at Cape Canaveral Air Force Station in Florida. While on the Red Planet, the Perseverance rover will flight test the Ingenuity Mars Helicopter, search for signs of ancient life, and collect rock and sediment samples to send back to Earth. Its astrobiology mission is to seek out signs of past microscopic life on Mars, explore the diverse geology of its landing site, Jezero Crater, and demonstrate key instruments and technologies that will help NASA prepare for future exploration.


www.renesas.com


Aldec, Inc. has achieved the AWS IoT Greengrass qualification for its TySOM family of Xilinx Zynq SoC-based Embedded Development Kits (EDKs). AWS IoT Greengrass extends Amazon Web Services (AWS) to edge devices so they can act locally on the data they generate, while still using the cloud for management, analytics, and durable storage. With AWS IoT Greengrass, connected devices can run AWS Lambda functions, Docker containers, or both, execute predictions based on machine learning models, keep device data in sync, and communicate with other devices securely – even when not connected to the Internet.


www.aldec.com


/ ELECTRONICS


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