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PRODUCTS EDITOR’S CHOICE
DEVELOPMENT OF EMBEDDED SYSTEMS
A new collaboration has been established that brings the realms of automotive safety together with high security connected and autonomous high performance automotive systems. Within the collaboration, ETAS will
provide and support the LynxSecure Separation Kernel for the automotive market. In addition, ETAS is supporting LynxSecure with a version of the RTA- BSW AUTOSAR solution and the ESCRYPT embedded security solution to run within the lightweight isolated virtual machine containers of LynxSecure. This combination aims to address real-time use-cases which demand the highest level of safety and security. The Separation Kernel allows the
powerful microprocessor-based hardware to be partitioned and isolated into different virtual machines
allowing software applications to co- exist while providing freedom from interference. The technology also offers the unique LynxSecure Application virtual machine containers. These bare-metal virtual machines are highly efficient allowing application code to run directly on the microprocessor without the need for a guest operating system. The LynxSecure Application bare
metal virtual machine technology integrates the classic AUTOSAR environment provided by the ETAS RTA-BSW. This illustrates how existing AUTOSAR software can be integrated into a DC/VC ECU, while providing the necessary safety, security, and freedom from interference that the most demanding applications require.
www.lynx.com
SUPPORTING USB-C CONNECTIVITY
With the aim of supporting USB-C connectivity, Congatec has released its new SMARC 2.0 modules. The USB-C specification aims to make USB interconnects more widely adoptable, further standardising the interface setup of SMARC 2.0 based embedded devices. By using USB-C for standard peripherals from USB 3.1 to USB 1.0 and - a brand new option - for connecting displays or even the power supply to the system or peripheral devices, reduces cabling to a single cable. In addition, the current data throughput of up to 5Gigabit/s in line with the USB 3.1 specification serves as a turbo charger for data intensive applications. Based on Intel Atom, Celeron or Pentium processors (Apollo Lake), typical applications for SMARC 2.0 designs
are handhelds and other mobile devices, in-vehicle devices and stationary embedded and IoT systems with low power and high performance demands. Fully featured USB-C jacks are still
rare and present a real breakthrough for standardising the fragmented world of cable-based external interconnects. Such standardisation is very beneficial for system engineers as well as system integrators, administrators and device users. System engineers don't need to think about the interface setup anymore. They only need to specify the number of USB-C compliant peripherals they want to interconnect and design in USB-C interfaces accordingly.
www.congatec.de
IMPROVED DESIGN FOR MOBILE AND IOT
Cadence Design Systems, Inc. has added enhancements to its integrated design flow for TSMC’s advanced wafer-level Integrated Fan-Out (InFO) packaging technology. The integrated flow provides design and analysis capabilities and modelling of cross-die interactions for mobile and IoT. The tools in the enhanced
flow include the OrbitIO interconnect designer, System- in-Package (SiP) Layout, Quantus QRC Extraction Solution, Sigrity XtractIM
technology, Tempus Timing Signoff Solution, Physical Verification System (PVS), Voltus-Sigrity Package Analysis, Sigrity PowerDC technology and Sigrity PowerSI 3D-EM Extraction Option. The OrbitIO interconnect
designer handles multi-die integrations with TSMC InFO technologies to generate top- level netlists that can be directly used for subsequent design steps such as detailed electrical and timing analysis.
www.cadence.com
/ ELECTRONICS ELECTRONICS | APRIL 2017 5
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