PRODUCTS TECHNOLOGY IN TRANSPORT MCUS WITH BUILT-IN LCD DRIVER FOR DATA LOGGERS


oscillation type AD converter), data acquisition (i.e. temperature, humidity, acceleration), data display, and PDF file generation on a single chip. Concerns about the safety and


T


he latest 32bit microcontrollers have been launched by Rohm,


that are ideal for data loggers used in logistics for acquisition and management of environmental information in package shipment. The ML630Q464/466 are one of


the first ICs to integrate all major functions required for data logging (USB, high-speed clock generation, LCD driver, high-accuracy RC


security of foods and medicines have expanded the use of logistics systems to maintain cold temperatures (cold chain) without interruption, from production to transportation and consumption, particularly for perishables and pharmaceuticals. Consequently, in the logistics industry it will be necessary to manage the transportation environment that affects package quality – namely temperature, humidity, and shock/vibration. This is expected to


increase demand for management tools such as data loggers by more than 10% per year. In response, the ML640Q464/


466 provide PDF file generation and integrate key functions for USB data logging on 1 chip while leveraging LAPIS Semiconductor’s expertise in low power consumption, high noise immunity, and high performance. These new MCUs utilise an ARM


Cortex M0+ 32bit CPU core to achieve high performance with low power consumption. Log data can be easily converted to PDF in about four seconds and operation is enabled for up to 380 days using a single coin battery.


www.rohm.com/eu


NON-CONTACT POWER SUPPLY


The vPOWER product range of inductive energy transmission systems, from Vahle supplies power to automated guided vehicles. Unlike in a transformer, the vPower primary coil is a long conductor loop, while the secondary coil is placed on an open ferromagnetic core and mounted as a PickUp module on the mobile unit. Power to the primary conductors is provided


by a primary inverter unit. It converts the three phase AC voltage into a single phase AC with a frequency of 140kHz while supplying the primary conductor with a constant current. The power modules provide 10kW each and can be cascaded up to 40kW per power feed segment. For the vehicles, there are PickUps for 1.5kW,


AUTOMOTIVE POWER MOSFETS IN NEW THERMALLY-ENHANCED PACKAGE


Nexperia, which used to be the Standard Products division of NXP, has released automotive power MOSFETs in the new, LFPAK33, thermally-enhanced, loss-free package, which has a footprint more than 80 percent smaller than industry standard devices. LFPAK33 devices also feature a significantly lower resistance responding to growing industry pressure to reduce the size of modules in the car while continuing to improve energy efficiency and reliability. This range of MOSFETs enables the power infrastructure that allows next-generation automotive subsystems such as radar and ADAS technology to operate reliably and efficiently. The device package uses a copper clip design to reduce the package resistance and inductance, which in turn


reduces the RDS(on) and losses of the MOSFET. The resulting package has an ultra-compact footprint of 10.9mm2, and because no wires or glue are used internally, operating temperatures of up to 175o


C T¬j max are


possible. Devices can handle up to 70A, and the extensive product portfolio includes devices that range between 30V – 100V and an RDS(on) as low as 6.3mΩ. Target applications include: connected auto modules, next generation engine management systems; chassis


and safety technology; LED lighting; relay replacement; C2X, radar, infotainment and navigation systems; and ADAS. MOSFETS in the new LFPAK33 compact automotive power package are now available. www.nexperia.com


2.5kW or 3.3kW power featuring excess current and excess temperature protection. Parallel deployment is possible. The company also offers sensors to keep AGVs on the right track as well as optional supercap power reserves to allow vehicles to temporarily leave the track. Contact-free energy transmission provides


major advantages over conventional conductor rails. This line-up of components comprises technologies that cover all requirements for energy supply, drive control, positioning, and data transfer to and from transport vehicles. www.vahle.de


New audio software products for integrating advanced audio post- processing algorithms have been released by Silicon Labs. These devices simplify use of audio post-processing functions such as tone control, cabin equalization and chime generation using the company’s Si47911/12 ICs’ with Tensilica’s HiFi EP DSP. The development tools can be used to port audio algorithms and design custom audio processing flows using the company’s library of audio functions, or combine their audio algorithms with audio post- processing functions. www.silabs.com


PORTFOLIO OF 48 GIGABIT ETHERNET CHIPS IDEAL FOR AUTOMOTIVE


range is suited to high-speed networks and includes single-chip Gigabit Ethernet switches with integrated HSR/DLR redundancy for ultra-high reliability in critical manufacturing applications. Also included is an automotive-grade USB 3.1 Gen 1 to Gigabit Ethernet bridge, which supports Advanced Driver Assistance Systems (ADAS) and infotainment systems.


A new portfolio of 48Gigabit Ethernet chips has been launched by Microchip, with certified compliance, comprehensive software support and copy-ready evaluation tools. The new GigEpack


32 APRIL 2017 | ELECTRONICS These devices are ideal for industrial,


automotive, and consumer applications and are certified by University of New Hampshire Interoperability (UNH-IOP) testing and come with


free software drivers. The GigEpack suite of products includes three


product families. The new KSZ9477/9567/9897 switch family, which includes features that allow ultra-reliable networks to be used with HSR/DLR redundancy and transport audio and video with Audio/Video Bridging (AVB). The KSZ9567 switch, for example, has 7-ports, an SGMII interface and also features EtherSynch technology. The new LAN7800/LAN7850/LAN7801 bridge


family enables the addition of Gigabit Ethernet to embedded processors via USB 3.1 Gen 1, USB 2.0 or High Speed Inter-Chip (HSIC) bridging to a variety of physical layers. www.microchip.com/GigEpack


/ ELECTRONICS


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