TECHNOLOGY IN ACTION ADVERTORIAL
Innovative Solutions For Very Different Challenges
W. L. Gore & Associates announces two new
innovative venting solutions: New GORE® PolyVent Stainless Steel, for premium-level durability under the most challenging conditions in the field and inside-mountable GORE® PolyVent InSet, for easy, cost-effective and nearly-invisible integration. According to Peter Kroker, Technical Manager, “GORE® Protective Vents’ PolyVent portfolio is growing as we advance our materials and engineering technologies. These two new products provide venting solutions for two very different needs and markets.” “PolyVent Stainless Steel uses premium-quality materials and construction to durably withstand the toughest challenges: from contact with the most aggressive cleaners and chemicals, to rugged industrial operating conditions, to environmental challenges like salty shoreline or even offshore locations.”
Gore
gore.co.uk/protectivevents
gore.com/protectivevent
Hamamatsu Photonics Granted Patents for Lightsheet Readout Mode in CMOS Cameras
L
ightsheet microscopy is rapidly becoming an important tool for biological research. Among its strengths are high speed selective plane acquisition, low phototoxicity to samples and low photo bleaching of fluorophores. There are a variety of lightsheet schemes that enable researchers to answer new questions in live cell imaging at scales that range from individual cells to whole organisms.
Hamamatsu Photonics has been granted patents for
their “Lightsheet Readout Mode” which takes advantage of the rolling shutter readout in scientific CMOS cameras. Lightsheet Readout Mode is currently available in the ORCA-Flash4.0V2 camera.
The patents place
Hamamatsu’s cameras in an ideal position regarding the lightsheet application and Hamamatsu will move forward on enforcing their rights under these patents.
Related Patents: • Japan <Patented (Patent No.)> JP05639670, JP05770958 • UK <Patented (Patent No.)> GB2522793, GB2523012, GB2523263 • Deutschland <Patented (Patent No.)> DE112014000195 • United States <Patents pending> • China <Patents pending>
Visit our Lightsheet Readout Mode special page:
www.hamamatsu.com/all/en/technology/innovation/lightsheetreadout/index.html
Hamamatsu 01707 294 888
www.hamamatsu.com
Many Roads Lead to ROHM T
he debut of ROHM Semiconductor at the Hanover Trade Fair 2016: a look behind the scenes at the
Japanese semiconductor manufacturer that offers forecasts on the industrial market and on ROHM’s goals with its Industry 4.0 technologies. ROHM is able to coordinate and control all production and manufacturing steps over the internet, across borders and time zones for its customers as well as its own cycles. With the fair focus on the digitalization of industrial processes, the company presented the "Internet of Things (IoT) Line of Approach”, based on applications examples of networked solutions for energy efficiency. Also demonstrated were innovative sensor applications, which, combined with networks and data processing, have applications in cloud-based machine status and environmental monitoring. These wireless sensor networks with optimized energy management are the result of synergistic cooperation within the ROHM Group, which also includes the subsidiaries LAPIS Semiconductor, Powervation,
SiCrystal AG and Kionix. Skills are bundled and technologies combined to create customer-specific solutions, such as a low-power wireless sensor network with integrated
communication modules linked via mobile telephony. In addition, ROHM presented a replica of the Venturi Formula E racing car. This showed that, with properly dimensioned SiC technology, the performance of completely electric powertrains can be improved through better thermal efficiency and the optimized shifting speed of SiC components. As a result, the Venturi Formula E team will now be using ROHM-manufactured power electronics in its inverter technology. For ROHM Industry 4.0 is not a new concept, but the logical consequence of the development and emergence of subsystems. The new challenge centers on the integration and optimization of systems and processes. This serves as motivation for ROHM to enhance its presence in Europe more broadly – as the company proceeds from its competencies in the semiconductor industry to develop new services benefitting the market.
ROHM Semiconductor GmbH +49 2154 921 0 / ELECTRONICS
www.rohm.com/eu Temperature
monitoring of glass heat treatment
A
t the glasstec exhibition in Düsseldorf, Germany, temperature measurement specialist Fluke Process Instruments (hall 14, stand B22) will showcase infrared thermometers and in-process temperature profiling solutions complete with glass- industry-specific analysis software. Together,
the
Datapaq, Ircon, and Raytek product lines cover all temperature measurement tasks in glass manufacturing that are otherwise hard to conduct. The thin gap between furnace and air quench is enough for a Raytek GS150 infrared temperature monitoring system to generate a full thermal image of the glass sheet. The 150 Hz infrared linescanner offers a superior resolution with up to 1,024 measurement points per line,
revealing even
minimal temperature deviations. The technologies are complimentary: profiling runs with a data logger serve the purpose of quickly setting up production lines for different glass types and thicknesses, whereas non-contact infrared measurement technology supports 100% production monitoring and traceability.
Fluke Process Instrument +49.30.478 008-412
www.flukeprocessinstruments.com
ELECTRONICS | July/August 2016 37
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