According to the company, its new service
compresses what typically takes internal engineering teams 12 to 18 months into a four to six month delivery window, covering antenna redesign, firmware updates, and end-to-end certification management. Dunstan Power, director at ByteSnap Design, said: “The sunsetting of 2G and 3G networks has created a genuine minefield for companies developing embedded products. It’s no longer just about hardware; manufacturers are facing a complex choice between multiple migration paths while simultaneously navigating new compliance headaches like the Cyber Resilience Act (CRA). “The new service helps to streamline and
accelerate the cellular migration pathway. By plugging our specialist connectivity capability into an existing team, we can resolve the technical uncertainties that cause projects to drift, helping manufacturers move from a stalled
According to the company, Teramount’s
TeraVERSE platform provides a pragmatic, field-serviceable interface between optical fibre and silicon photonics chips and was recently announced as part of the Molex one-stop CPO solution. “Teramount’s TeraVERSE technology fills a crucial gap in the CPO stack, offering an advantaged and strategic complement to our optical solutions portfolio. With a practical, detachable fibre-to-chip interface we are afforded a foundational element to realise mainstream CPO adoption,” said Aldo Lopez, president, Datacom Solutions, Molex. “Combining Teramount’s IP and engineering talent with Molex’s innovative portfolio, manufacturing scale, supply-chain expertise and systems know-how gives customers an integrated, high-volume path to deploy scalable CPO.” Adding to this, Hesham Taha, CEO and
co-founder of Teramount, said: “Harnessing Molex’s global scale and system-level expertise with Teramount’s innovation expertise and detachable, wafer-level coupling technology creates a real pathway for scalable, high-density CPO. “Joining forces with Molex will enable us
to accelerate delivery of a manufacturable, serviceable fibre-to-chip interface that meets the pressing needs of AI and hyperscale data centers.”
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prototype to a production-ready launch in a matter of months. We offer end-to-end engineering support from firmware development, PCB design, right through to production.” ByteSnap Design’s new Fast-Track Cellular
Migration service has a simple three-step process: a Migration Readiness Assessment (completed within 3–5 days); a full Fast-Track Execution covering hardware redesign, antenna optimisation, firmware updates and certification management (over 4-6 months); and a Certified Product Launch, where manufacturers receive their product-ready design, complete documentation. Manufacturers requiring long-term compliance management support can also make use of ByteSnap Design’s optional ongoing Cyber Resilience Act support services, including SBOM Management, targeted OTA update releases, quarterly obsolescence monitoring, and priority fast-track access.
Unlike traditional brokers which mainly deal in obsolete products and hold no stock, ADIOS focuses
on current parts and has a significant inventory. By buying through established, reputable and constantly-audited suppliers in the Far East, ADIOS is said to be able to offer genuine parts at up to 30% cheaper than the major franchised distributors. ADIOS has continued to broaden its product portfolio and stocked inventory. Because the company includes personnel who are all veterans of the industry with many years experience, and employs bespoke software systems to track business across the industry, ADIOS knows which parts are most commonly required by customers. The company now offers a wide range of analogue and embedded parts, MCUs and FPGAs. All suppliers to ADIOS are strictly audited, stopping counterfeit components and ensuring a
rigorous supply chain. Incoming parts are subject to thorough inspection, including examination using equipment from ABI Electronics, a leading specialist electronic test and measurement supplier. ADIOS is also certified to AS9120. Steve Rawlins, ADIOS’ CEO, said: “I want to make it clear that ADIOS was launched in response
to customers’ requests. I have looked at outsourcing many times, and always decided against, but now the supply chain has changed and I can see a role for responsible outsourcing. We are not chasing the same back-to-back business as the majority of other brokers. We are looking to service those customers who are being let down, typically, by certain big US semiconductor makers who have significantly increased prices while slashing their distribution networks and restricting customer choice.”
While most members are SMEs based in the south and south-east, it has companies of all sizes
from across the UK and internationally. Its CEO, Alan Fisher, said: “The benefits of joining us are many and varied and we have worked
hard to make businesses aware of them. “Our aim is to help our members win business and one way we do that is by making introductions to the Tier 1 companies. We have members in the aerospace, aviation, defence and space sectors as well as all their supply chains. Some of them will be joining us at our stand at this summer’s Farnborough International Airshow, which will be an extremely important week.” The FAC has also launched a podcast, is continuing to develop its website, and offers networking events.
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