PRODUCTS TECHNOLOGY FILE THERMOPAD TEMPERATURE VARIABLE ATTENUATOR FOR SPACE FLIGHT APPLICATIONS
New from Smiths Interconnect is the SpaceNXT K2TVA Thermopad Temperature Variable Attenuator for gain
compensation over temperature. Designed and tested for critical
space flight applications, this offers a highly reliable, totally passive, solution to offset signal strength fluctuation
due to changes in temperature – an issue that affects all RF and
microwave systems. The attenuation shift over temperature is achieved using thick-film thermistor inks which are screen printed onto a ceramic substrate of Alumina. This patented technology
was invented in-house within EMC Technology, one of Smiths Interconnects’ technology brands.
The SpaceNXT K2TVA Thermopad offers a number of benefits:
• Each product is engineered using 3D Electromagnetic Simulation (EM) software to provide excellent TCA targeting. This aids in obtaining the best attenuation flatness and Voltage Standing-Wave Ratio (VSWR) within the specified frequency band.
• The Thermopad can be used in place of a standard chip attenuator to combine level setting or buffering and temperature compensation in a single-chip design. This reduces the component count whilst increasing reliability and lowering costs.
• Using robust proven thick-film process technology on an Alumina substrate provides a product suitable for applications in harsh environment.
• The Temperature Coefficient of Attenuation (TCA) is up to four times over the original KTVA Series, allowing RF designers even more precise temperature compensation.
•Multiple attenuation values, temperature shift options and mounting configurations are available to support both surface mount and wire bond applications.
Smiths Interconnect
www.smithsinterconnect.com
COMPONENT CARRIERS REPLACE FLEXIBLE PCBS
New from HARTING is a component carrier that can be used directly with electronic components, eliminating manual assembly and replacing flexible PCBs. The component carrier serves as a connecting element between a PCB and electronic components (such as LEDs, ICs, photo–diodes or sensors). The measuring sensors of a scanning head for position
detection, for example on a linear slide with guide rails, are often mounted onto flex PCBs. As magnetic, optical or inductive systems, they record the exact position of the slide. To do this the sensors must be positioned exactly at a 90˚ angle. The capability to mount these as precisely as possible improves the accuracy of the measurement results. A second sensor is often installed in the measuring head for redundancy. In addition, the status of the evaluation electronics is displayed using LEDs; these are mounted onto a flex PCB. With the component carrier, the flexible PCB can be
replaced completely. The injection-moulded plastic body already provides very precise 90˚ angles for mounting sensors; and the component carrier eliminates the need for time- consuming manual assembly of the flex PCB. In addition, the sensors are positioned more precisely. Another advantage of the component carrier is that the width of the sensor modules can be further reduced to less than 8mm. The component carrier with the assembled electronic
components comes in a blister pack for further processing in SMD assembly facilities, and the soldered components are secured with an adhesive so that they cannot detach from their position while in the reflow oven.
HARTING 3D-MID
www.3d-mid.ch
RESEARCHERS DEVELOP NEXT GENERATION SENSING TECHNOLOGY
Researchers at AMBER, the Science Foundation Ireland Centre for Advanced Materials and BioEngineering Research, and Trinity’s School of Physics, have developed next generation graphene-based sensing technology using their innovative G-Putty material. The printed sensors are said to be fifty times more sensitive than the industry standard and outperform other comparable nano-enabled sensors in an important metric seen as a game-changer in the industry: flexibility. Sensitivity and flexible, these are suitable for the emerging areas of wearable electronics and medical diagnostic devices. The team - led by Professor Jonathan
Coleman, head of the School of Physics at Trinity, demonstrated that they can produce a low cost, printed, graphene nanocomposite strain sensor. They developed a method to formulate G-putty-based inks that can be printed as a thin-film onto elastic substrates, including band-aids, and attached easily to the skin. Creating and testing inks of different viscosities, the team found that they could tailor G-Putty inks according to printing technology and application, publishing their results in the journal Small this week. In medical settings, strain sensors are a highly valuable diagnostic tool used to measure changes in mechanical strain such as pulse rate, or the
changes in a stroke victim’s ability to swallow. A strain sensor works by detecting this mechanical change and converting it into a proportional electrical signal, thereby acting as mechanical-electrical converter. While strain sensors are currently available, they are mostly made from metal foil that pose limitations in terms wearability, versatility, and sensitivity, the team explain. Dr Daniel O’Driscoll, Trinity’s School of
Physics, explains: “The development of these sensors represents a considerable step forward for the area of wearable diagnostic devices – devices which can printed in custom patterns and be comfortably mounted to a patient’s skin to monitor a range of different biological processes. We’re currently exploring applications to monitor real time breathing and pulse, joint motion and gait, and early labour in pregnancy. Because our sensors combine
high sensitivity, stability and a large sensing range with the ability to print bespoke patterns onto flexible, wearable substrates, we can tailor the sensor to the application. The methods used to produce these devices are low cost and easily scalable – essential criteria for producing a diagnostic device for wide scale use”.
AMBER
https://www.sfi.ie/sfi-research-centres/amber/
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JUNE 2021 | DESIGN SOLUTIONS
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