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FEATURE


IOT & SMART MANUFACTURING


ACCELERATING QUANTUM SENSOR INNOVATION


With measurement capabilities that approach the theoretical limits of sensitivity, quantum sensors are poised to revolutionise various fields, but the development and deployment of these often requires sophisticated equipment and resources. However, thanks to additively manufactured electronics, the BMBF Cluster4Future QSens initiative aims to bridge the gap between academic research and industrial application by developing scalable, affordable, quantum sensors for a wide range of fields


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apable of detecting even the faintest of signals – such as magnetic fields, temperature changes, and brain activity –


with extreme precision, quantum sensors have the potential to transform a diverse range of industries. Developing these, however, requires access to specialised, high-cost resources, typically only available in large research institutions and laboratories. Even then, production is hampered by slow and complex processes with limited scalability, ultimately hindering innovation and pace of research. QSens ‘Quantum Sensors of the Future’ – a


consortium comprising 15 industrial partners, the Universities of Stuttgart, Ulm and Tuebingen, the Charité in Berlin, and three research institutions – has set itself the task to overcome these barriers and pioneer the advancement of quantum research at an unprecedented pace. With the mission to bring quantum sensors to the market over the next five to nine years, the group sought a solution that would address these key challenges and allow for the scalable integration of electronics, photonics and quantum sensor technology, while reducing the time and cost investment that typically restricts accessibility.


THE SOLUTION The team at the University of Stuttgart integrated Nano Dimension’s DragonFly IV 3D printing system, a cutting-edge platform for AME, into its research workflow and manufacturing platform Quantum4SME. This combines additive manufacturing with the ability to print both conductive and non-conductive materials in a single process, unlocking the creation of complex, multi-layered electronic circuits and, critically, the heterogeneous integration of quantum devices. These include electronic circuits, sensors, photonic elements or other components in compact devices with high packaging density. This is critical in creating specialised quantum devices for a range of applications, from measuring brain activity or nerve signals in the medical field, to evaluating atomic structure in chemical engineering. Traditional manufacturing of electronic


components – particularly complex devices such as advanced quantum sensors – often involves


lengthy and costly processes, including multiple stages of design, prototyping and testing. Leveraging AME drastically streamlines this process, allowing for rapid prototyping and immediate testing of new designs. Crucially, this efficiency reduces the time and financial barriers associated with developing and refining quantum sensors. By doing so, institutions are not only able to access these advanced technologies, but to compete with larger, better-funded counterparts – ultimately driving the industry forward and boosting the pace of innovation.


A STEP-CHANGE IN RESEARCH Since its installation in a dedicated research building within the Center for Applied Quantum Technology (ZAQuant) at the University of Stuttgart, experts in quantum physics, photonics and engineering science have been able to collectively leverage the capabilities of the Dragonfly IV for applied quantum research – with transformative effect. Within months of installation, the 3D printer has created a step- change in the pace of research and opened up entirely new interest areas in a number of fields. “We use a lot of microelectronics and photonic


integration technologies that rely on hybrid integration solutions, such as additive manufacturing, to bring these technologies together,” explains Professor Dr. Jens Anders,


26 DESIGN SOLUTIONS JULY/AUGUST 2025


QSens. “The Dragonfly IV is designed for multi- material, multi-layer 3D printing, so it can create entire circuits in one step, including conductive structures and non-conductive structures, to heterogeneously co-integrate electronic devices and our quantum sensors. This is key in producing devices that are scalable – ultimately a critical part of bringing quantum technology farther and wider, so that its many benefits can be accessed by more institutions in a greater number of industry sectors.” Felix Schuderer, of the Institute of Smart


Sensors, added: “Our aim is to bring quantum sensors to everyone in the world, not for it to be restricted to big laboratories with very heavy instrumentation.” The Dragonfly IV provides a crucial next step in advancing this journey.


MEDICAL INDUSTRY POTENTIAL Whilst QSens’ research spans a vast array of application areas, the potential for medical devices is arguably one of the most significant – with the Dragonfly IV also already proving transformative in areas such as Magnetic Resonance Imaging (MRI). The MRI process requires highly sensitive and


precisely manufactured coils to detect the faint magnetic fields generated by atomic nuclei. AME enables the rapid production of custom-designed coils with optimised geometries and material


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