ADVERTORIAL TECHNOLOGY IN ACTION Sensor Integration Machines Boost SICK’s ‘Edge’ Processing Power

Smiths Interconnect Enhances Customer

Efficiency with Probe Heads for Wafer Level Testing

test, Smiths Interconnect announces today the launch of its Volta 200 Series Probe Head. A departure from cantilever and more traditional vertical


probe technologies, the Volta Series enables quicker test set-up time and on-line cleaning & maintenance while assuring impeccable site to site planarity. Smiths Interconnect Volta Series Probe Head supports

testing from 200 µm pitch and greater and provides additional benefits including: • Extremely short signal path (≤ 3.80mm) enabling low and stable contact resistance, high current carrying capacity and longer life cycle.

• Proprietary engineered plastic and machined ceramic materials providing high site to site planarity.

• Ability to test at production, engineering development and failure analysis stages.

• Flexibility of testing sorted die on all sites simultaneously with the Volta Manual Actuator.

• Elimination of die cracking even after repetitive manual tests, enabling probe card bring-ups prior to the wafer availability.

Smiths Interconnect 

ddressing an ongoing industry need to improve wafer test production efficiency and reduce overall cost of

with the launch of two high- performance, one-box, processing hubs that fuse decentralised, multi- sensor co-operation with field-to-cloud connectivity as part of Industry 4.0. The SICK SIM1000 and SIM2000


Sensor Integration Machines are programmable sensor connection and data processing hubs that open up new possibilities to develop custom applications in SICK’s AppSpace ecosystem. With up to four Ethernet ports, they support interfaces for cameras, lighting, LiDAR scanners, encoders, photoelectric and displacement sensors, as well as to higher level controls and to the Cloud.

The SICK SIM1000 and SIM2000 collect and evaluate data from multiple sensors working together at the field-

level via standard interfaces including Ethernet for cameras and LiDAR sensors, and as well as IO-Link, CAN and Serial. The multi-sensor outputs, values and results can be used to drive typical industrial automation applications such as camera-based inspection, measurement, or identification of objects. Collected data can be processed and displayed e.g. for quality control, process analysis, material management or

condition monitoring purposes, while the information is monitored, archived and distributed for diagnostic purposes via cloud-based services. The programmable SICK Interface and Algorithm API facilitates full image and sensor processing with a range of

model options to cover all industrial sensor, LiDAR and vision applications, as well as a configurable firewall for security in data capture. The SIM2000 processing core also facilitates interfacing with a HALCON image library for advanced sensor data and image processing. The SICK SIM1000 and SIM2000 do not require fan-cooling and are housed in enclosures rated to IP20 or IP65,

depending on model, so are compatible with a range of industrial conditions, including dirty, dusty and humid environments. The flexibility of the housing options enable mounting at the machine or in a separate cabinet.

SICK  01727 831121  New EASYTEC

Flanged Enclosures For Sensor Electronics


KW has launched EASYTEC, a new range of flanged plastic enclosures for modern sensor electronics. The

integrated flanges permit easy mounting on poles/tubes or flat surfaces with cable ties or screws. Robust and IP 65 rated EASYTEC is designed to survive

industrial environments – either indoors or outdoors. Applications include IoT/IIoT, sensor systems, security and monitoring, IT, control, environmental, medical and laboratory technology. EASYTEC is available in two plan sizes (80 and 100) and

two heights – giving a range of four sizes from 101 x 50 x 22 mm to 121 x 62 x 31 mm. They are moulded from UV-stable ASA+PC-FR. The standard colour is off-white (RAL 9002). Internal screw pillars in the top and base mean each

Measuring 119.5 x 40 x 20mm, the AZM40 interlock is ideal for small safety doors and flaps. Despite its compact size, the interlock can produce


2kN of force. The RFID technology. The RFID technology results in a “high” coding level, offering increased tamper protection in accordance with DIN ISO 14119. The interlock operates on the bistable principle. If

power is lost, it stays in position. This ensures safe operation, whatever the status of the machine. Even if there are hazardous run-on movements, the safety door will remain locked. Another advantage of the bistable design is low energy consumption, because the interlock needs power only when the door is locked or unlocked.


Electronic RFID based solenoid interlock is ‘world’s smallest’ Thanks to the actuator's 180° angle flexibility, it can

chmersal has developed an RFID based solenoid interlock which it claims in the world’s smallest.

approach the interlock on a stepless basis, making it suitable for flaps that do not close at 90° or those that open upwards to a 45° angle. This helps the interlock to fit into tight and hard-to-access spaces. For applications with personnel protection (interlock

monitored), the safety outputs are switched on when the safety door is closed and the interlock is locked. An actuator-monitored version can be used for applications with process protection. In this variant, the safety outputs are actuated as soon as the safety door is closed.

Schmersal  01684 571980 


enclosure can accommodate two PCBs. The enclosures can be supplied fully customised.

OKW Enclosures Ltd  01489 583858

ICK has extended its Sensor Integration Machine (SIM) family

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