NON CONTACT MEASUREMENT & INSPECTION FEATURE
FOUP or customised input and output cassettes), robots for handling five to 12 inch wafers, integrated scanners for wafer tracking, along with other features required of such systems. For volume inspection of single
crystal ingots (e.g. Si, Ge, GaAs) a multiple transducer scanning system (four heads) is used to estimate the three-dimensional location of defects inside the crystal volume.
“The unique characteristic of acoustic microscopy is its ability to image the interaction of acoustic waves with the elastic properties of a specimen"
In this way, the tool is capable of
analysing voids and inclusions, estimating their depth and size simultaneously. The tool can inspect five to 12 inch Si ingots up to 400mm thickness and a weight of 75kg. The defect resolution may reach down to 100μm voids in Silicon. Hoffrogge says there are a significant
number of systems in production performing inline inspection of sensitive electronic devices transported in JEDEC-Trays.
Regardless of the type of component inspected, each system includes integrated data analysis and automation software, GEM/SECS interface for fab host communication and other key features.
CUSTOMISED EQUIPMENT For applications with unique product geometries and sizes, companies like PVA TePla can build on core platform components that utilise the latest technology. When even higher throughput is
required, up to four transducers can simultaneously scan for higher throughput. Multiple transducers can be used on a single substrate and the images then stitched together, or multiple transducers can simultaneously scan multiple substrates. Throughput can also be increased by
incorporating ultra-fast single or dual gantry scanning systems or six-axis robots. Other possible add-ons include rotation axes (flipping), vacuum chucks and customised water tanks. “We have a large portfolio of core
components which have become standard for us that are used or modified to provide rapid solutions to our customers,” says Hoffrogge. “We basically have the complete value
chain available in house, so we can speed the development process from the conception of a project through to a complete process qualification, providing maximum value to our customers.” Even transducers, the heart of all SAM systems, are manufactured internally to meet specific scanning requirements. Transducers are adapted to each application or specific customer device and inspection requirement, ensuring the highest level of defect detection. PVA TePla Analytical Systems, for example, design and manufacture transducers in a very wide frequency range from three to 2,000MHz. The company performs this work in-house, utilising proprietary thin film technology it has developed over many years. “We are able to manufacturer transducers that are within the standard cost and lead times of the industry,” says Hoffrogge. “We have all the equipment for manufacturing and testing in house, so we don’t have to rely on third parties for items such as optical components where they often have very significant lead times.”
PVA TePla Analytical Systems
www.pvateplaamerica.com
TR-Electronic introduces the SIL shaft encoder CD_582+FS
• SIL 3/ SIL 2 – PROFIsafe rotary encoder in industrial standard size 58 mm
• Redundant setup (Cat 4): two completely independent multi-turn encoders in one.
• Option: Incremental interface (HTL, TTL, sin/cos)
INSTRUMENTATION | JUNE 2018 23
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