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SMOOTHING COMPOUNDS NO COMING UNSTUCK


Flooring contractors working as part of a refurbishment will often find old adhesive residues upon the removal of floorcoverings. For these situations, smoothing compounds are available that can be applied directly over old adhesive residues, eliminating the need to spend valuable time mechanically removing them, explains F. Ball.


Applying a smoothing compound to a subfloor is the usual first step in creating a suitably smooth base for the receipt of new floorcoverings, helping to ensure a visually attractive finish. Before doing this, contractors will normally need to make sure that the substrate is free of contaminants that could cause debonding of subsequently applied subfloor preparation products, potentially resulting in complete floor failure. Where flooring installations are part of a refurbishment, this will often mean the mechanical removal of old adhesive residues.


In such situations, one particular development in smoothing compounds is helping to install floorcoverings as quickly as possible, a benefit to flooring contractors facing increasing pressure to complete projects to ever shorter timescales.


FAST-TRACK SOLUTION


When flooring installations are part of a refurbishment and adhesive residues are left behind following the removal of old floorcoverings, smoothing compounds are available that can be applied directly over old adhesive residues; eliminating the need to spend valuable time mechanically removing them. Such products are formulated to minimise the stresses inflicted on adhesive residues as the smoothing compound sets so that they maintain their integrity and do not debond from the subfloor, potentially compromising the installation.


In most cases, there is no need to apply a primer beforehand, saving further time and expense. The best of these smoothing compounds are usually able to accept foot traffic about one hour after application and are ready to receive new floorcoverings from around four hours later. They also have the benefit of allowing contractors to use the same product in situations where newly installed subfloors and areas with old adhesive residues present are next to each other.


NEW FORMULATIONS


The latest advancements in technology have enabled F. Ball to create a new fast-track, water-mix smoothing compound that can be applied over old adhesive residues, Stopgap 1500. Such products have previously only been available in bag and bottle formulations.


The new smoothing compound is suitable for preparing a wide range of sound internal subfloors in commercial and residential settings prior to the installation of new floorcoverings and can be applied over a wide range of insoluble, well-bonded adhesive residues, including bitumen, carpet tile tackifiers and ceramic tile adhesives.


Just as with market-leading bag and bottle versions, the product is walk-on hard in as little as 60 minutes after application and ready to receive floorcoverings from just four hours. As a water- mix smoothing compound, no bottle is required, meaning less plastic waste is produced by the flooring industry.


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PRIOR PREPARATION


Before a smoothing compound is applied, contractors should begin any flooring installation by ensuring the subfloor is suitably sound, smooth and dry enough for the receipt of new floorcoverings. This may necessitate repairs to the subfloor or the removal of surface contaminants apart from old adhesive residues, such as oil, grease, paint or other chemicals.


F. Ball recommends that a moisture test is then conducted to determine subfloor moisture levels. Where a moisture test indicates that the relative humidity (RH) level within the subfloor is above 75% (65% if bonded wood floorcoverings are to be installed), a waterproof surface membrane will be required to prevent floor failure.


After these steps have been undertaken, the application of an appropriate smoothing compound is the final stage in the subfloor preparation process before new floorcoverings can be installed.


https://f-ball.com/en www.tomorrowscontractfloors.co.uk


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