INSTRUMENTATION • ELECTRONICS
HEIGHT MEASUREMENT OF WAFER BUMPS C
omputer chips are manufactured in large quantities
on a wafer. On the chips there are countless small, spherical contact surfaces – so-called ‘bumps’. These must be of a uniform height to function properly when stacked later. Confocal sensors from Micro-Epsilon determine the height of the wafer bumps with micrometre precision in the production line.
Confocal chromatic
sensors from Micro-Epsilon measure precisely on the shiny and structured surfaces of the computer chips. Thanks to the focused light spot, a high lateral resolution of around 4 µm is also achieved.
For inline monitoring, three confocalDT IFS2405 sensors are positioned slightly offset above the wafer. This generates three tracks on one bump. From the three tracks, both the spherical shape and the height can be calculated exactly.
The controllers are
connected via Ethernet and trigger input and perform a synchronous measurement. Therefore, the height of the wafer bumps can be measured with micrometre accuracy. The encoder value is also fed into the motion unit.
To be able to measure the large number of chips and therefore also the bumps in the shortest possible time, confocal sensors from Micro-Epsilon offer
an extremely high measuring rate up to 70kHz. l
For more information visit
www.micro-epsilon.com
NEW CONDUCTIVE-COOLED COMPUTER M
PL has introduced another milestone of conductive- cooled Intel Xeon E-2276ME &
i7-9850HE CPU systems with integrated NVIDIA RTX 5000 GPU cards with 3072 CUDA cores. The total solution requires no fan and can be operated in an environment of -20°C to 55°C. MPL’s strength are computing and network solutions that work without the need of any active cooling. The company has provided passive cooling concepts for more than 35 years. Thousands of fanless
solutions perform their services trouble free in the toughest environments for years. The conductive cooling solutions from
MPL are not achieved by using heat pipes. The concept starts with the design of the MPL CPU boards, the peripherals and the selection of parts. This method allows to mount the solution in any orientation a customer needs or has space for, compared to heat pipe solutions. Only low power consumption and long-term available parts are selected. The heat-generating components are placed without any compromises on the back side of the base board. This is to connect all hot spots directly to the surface of the case, hence no heat is accumulated internally within the housing. To achieve this specific design, special know-how is needed
26
www.engineerlive.com
to allow changes of the reference design Intel provides. Many available products are derived from the reference design of Intel, which are created for the commercial computers. Naturally, such designs are not ideal for rugged environments. With its know-how and years of experience, MPL designed the MILCOTS4x-GPU, a conductive cooled Xeon i7 9th generation CPU system with integrated NVIDIA RTX 5000 GPU card (other GPU cards can be used in place of the RTX 5000.) The D38999 MIL connectors are soldered on special MPL designed rigid-flex PCBs.
The MILCOTS4x-GPU has been designed to withstand any harsh environments and extreme temperature conditions. Particular precautions during the design have been taken that the entire system EMC is within the MIL-STD-461 standards and MIL-STD-810 can be met. l
For more information visit
www.mpl.ch
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52
