A unique combination of Plasma FIB and field-free UHR FE-SEM for multiscale materials characterization


1 mm cross-section through a Li-ion battery electrode 200 µm


TESCAN AMBER X


Ĭ High throughput, large area FIB processing up to 1 mm. Ĭ Ga-free microsample preparation. Ĭ Ultra-high resolution, field-free FEG-SEM imaging and analysis. Ĭ In-lens SE and BSE detection.


Ĭ Resolution optimization for high-throughput, multi-modal FIB-SEM tomography.


Ĭ Superior field of view for easy navigation. Ĭ Essence™ easy-to-use, modular graphical user interface.


TESCAN AMBER X is based on the S8000 platform.


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